Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941240 | Semiconductor chip scale package and manufacturing method thereof | Ming-Kai Liu, Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang +1 more | 2018-04-10 |
| 9921442 | Method for forming an alignment layer of a liquid crystal display device and display device manufactured thereby | Yin Qian, Dyson H. Tai, Ming Zhang | 2018-03-20 |
| 9806045 | Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2017-10-31 |
| 9698079 | Barrier structures between external electrical connectors | Shih-Wei Liang, Kai-Chiang Wu | 2017-07-04 |
| 9653341 | Semiconductor structure and manufacturing method thereof | Chao-Wen Shih, Shih-Wei Liang, Ching-Feng Yang | 2017-05-16 |
| 9627325 | Package alignment structure and method of forming same | Ming-Kai Liu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang, Yen-Ping Wang +1 more | 2017-04-18 |
| 9608023 | Edge reflection reduction | Yin Qian, Chao-Hung Lin, Chen Lu, Dyson H. Tai, Ming Zhang +1 more | 2017-03-28 |
| 9590005 | High dynamic range image sensor with reduced sensitivity to high intensity light | Yin Qian, Ming Zhang, Chen Lu, Jin Li, Dyson H. Tai | 2017-03-07 |
| 9559071 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2017-01-31 |
| 9543373 | Semiconductor structure and manufacturing method thereof | Shih-Wei Liang, Hsin-Yu Pan, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu | 2017-01-10 |
| 9472523 | Semiconductor structure and manufacturing method thereof | Shih-Wei Liang, Yen-Ping Wang, Kai-Chiang Wu, Ming-Kai Liu | 2016-10-18 |
| 9460989 | Interposer having a defined through via pattern | Shih-Wei Liang, Kai-Chiang Wu, Ming-Kai Liu, Chun-Lin Lu | 2016-10-04 |
| 9355924 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu +1 more | 2016-05-31 |
| 9337154 | Semiconductor device and method of manufacturing the same | Yen-Ping Wang, Hao-Yi Tsai, Shih-Wei Liang, Tsung-Yuan Yu | 2016-05-10 |
| 9263405 | Semiconductor device | Shih-Wei Liang, Kai-Chiang Wu, Yen-Ping Wang | 2016-02-16 |
| 9184143 | Semiconductor device with bump adjustment and manufacturing method thereof | Shih-Wei Liang, Kai-Chiang Wu, Yen-Ping Wang | 2015-11-10 |
| 9064873 | Singulated semiconductor structure | Shih-Wei Liang, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang | 2015-06-23 |
| 8664768 | Interposer having a defined through via pattern | Shih-Wei Liang, Kai-Chiang Wu, Ming-Kai Liu, Chun-Lin Lu | 2014-03-04 |