Issued Patents All Time
Showing 26–50 of 420 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266639 | Method of fabricating semiconductor package | Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2025-04-01 |
| 12260669 | Fingerprint sensor in InFO structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Yu-Chih Huang | 2025-03-25 |
| 12261092 | Semiconductor package and manufacturing method thereof | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Ban-Li Wu, Hsiu-Jen Lin +1 more | 2025-03-25 |
| 12261126 | Semiconductor package | Tsung-Hsien Chiang, Hsien-Ming Tu, Tin-Hao Kuo | 2025-03-25 |
| 12255196 | Semiconductor package with thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Lipu Kris Chuang, Tin-Hao Kuo | 2025-03-18 |
| 12255174 | Bonding passive devices on active dies to form 3D packages | Chen-Hua Yu, Kuo Lung Pan, Shu-Rong Chun, Chi-Hui Lai, Tin-Hao Kuo +1 more | 2025-03-18 |
| 12255184 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang, Tin-Hao Kuo | 2025-03-18 |
| 12243681 | Programmable inductor and methods of manufacture | Chen-Hua Yu, Mirng-Ji Lii, Hsien-Wei Chen, Hung-Yi Kuo, Nien-Fang Wu | 2025-03-04 |
| 12222545 | Package and method of forming same | Chih-Hsuan Tai, Chung-Ming Weng, Hung-Yi Kuo, Cheng-Chieh Hsieh, Chung-Shi Liu +1 more | 2025-02-11 |
| 12210200 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2025-01-28 |
| 12205860 | Sensor packages | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2025-01-21 |
| 12205923 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Chung-Shi Liu, Yu-Chia Lai, Po-Yuan Teng | 2025-01-21 |
| 12199051 | Integrated circuit structure and method | Chen-Hua Yu, Kuo Lung Pan, Tin-Hao Kuo | 2025-01-14 |
| 12176282 | Manufacturing method of semiconductor package | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh, Hung-Yi Kuo +7 more | 2024-12-24 |
| 12166015 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Kuo Lung Pan, Ting Hao Kuo, Yu-Chia Lai +3 more | 2024-12-10 |
| 12164158 | Package having prism structure and manufacturing method thereof | Che-Hsiang Hsu, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2024-12-10 |
| 12159839 | Semiconductor packages | Tzu-Sung Huang, Hsiu-Jen Lin, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo +1 more | 2024-12-03 |
| 12159851 | Package structure having hollow cylinders and method of fabricating the same | Chen-Hua Yu, Chung-Shi Liu, Tin-Hao Kuo | 2024-12-03 |
| 12142597 | Integrated fan-out package and the methods of manufacturing | Chen-Hua Yu, Kuo-Chung Yee, Tin-Hao Kuo | 2024-11-12 |
| 12132024 | Semiconductor package and method of manufacturing the same | Tzuan-Horng Liu, Cheng-Chieh Hsieh, Tsung-Yuan Yu | 2024-10-29 |
| 12125804 | Semiconductor package and manufacturing method thereof | Wei-Kang Hsieh, Tin-Hao Kuo, Shih-Wei Chen | 2024-10-22 |
| 12113022 | Semiconductor package and manufacturing method of semiconductor package | Ying-Cheng Tseng, Yu-Chih Huang, Chia-Hung Liu | 2024-10-08 |
| 12105323 | Semiconductor package | Chung-Ming Weng, Hua-Kuei Lin, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh +5 more | 2024-10-01 |
| 12100682 | Package structure with conductive patterns in a redistribution layer | Yu-Chia Lai, Chih-Horng Chang, Chih-Hsuan Tai | 2024-09-24 |
| 12080615 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Chen-Hua Yu, Kuo-Chung Yee, Tin-Hao Kuo | 2024-09-03 |