Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243791 | Semiconductor package | Doohwan Lee, Jooyoung Choi | 2025-03-04 |
| 11881472 | Semiconductor package | Yongjin Park, Won-mook Choi | 2024-01-23 |
| 11393767 | Semiconductor package and package-on-package devices including same | Sunghoan Kim, Jeongrim Seo | 2022-07-19 |
| 11393795 | Semiconductor package | Yongjin Park, Won-bong Choi | 2022-07-19 |
| 11342239 | Semiconductor package | Doohwan Lee, Jooyoung Choi | 2022-05-24 |
| 11152292 | Fan-out semiconductor package having metal pattern layer electrically connected embedded semiconductor chip and redistribution layer | — | 2021-10-19 |