Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor packages having semiconductor chips disposed in opening in shielding core plate

Semiconductor packages having semiconductor chips disposed in opening in shielding core plate

US Patent 9425156 · Granted Aug 23, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package2025
Semiconductor package2025
Semiconductor package including a dualized signal wiring structure2025
Semiconductor package for improving power integrity characteristics2025
Semiconductor package including an interposer and method of fabricating the same2024
Semiconductor package including dual stiffener2024
Semiconductor package including composite molding structure2024
Hybrid semiconductor device and electronic device2024
Semiconductor package and method of manufacturing the same2023
Chip on film package and display apparatus including the same2023
Semiconductor package2023
Test board and test apparatus including the same2023