Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646241 | Semiconductor package | Jaehoon Choi, Taewook Kim, Hwasub Oh, Jooyoung Choi | 2023-05-09 |
| 11205631 | Semiconductor package including multiple semiconductor chips | Yonghoon Kim, Jaehyun LIM, Yuntae Lee | 2021-12-21 |
| 9355931 | Package-on-package devices and methods of manufacturing the same | Jongkook Kim, Jangwoo Lee, Kyoungsei Choi, Donghan Kim, Hwanggil Shim | 2016-05-31 |
| 8105934 | Bump structure for a semiconductor device and method of manufacture | Yonghwan Kwon, Chungsun Lee | 2012-01-31 |