Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818732 | Chip-on-film package and device assembly including the same | Jae-Min Jung, KwanJai Lee, KyongSoon Cho, Jeong-Kyu Ha | 2017-11-14 |
| 9721926 | Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the same | Yeong-Hwan Choe, Tae-Joo Hwang, Tae Hong Min, Young Kun Jee | 2017-08-01 |
| 9620389 | Methods of fabricating tape film packages | Jeong-Kyu Ha, Youngshin Kwon, KwanJai Lee, Jae-Min Jung, KyongSoon Cho | 2017-04-11 |
| 9431272 | Printed circuit board including through region and semiconductor package formed by using the same | Chae Hun IM | 2016-08-30 |
| 9241407 | Tape film packages and methods of fabricating the same | Jeong-Kyu Ha, Youngshin Kwon, KwanJai Lee, Jae-Min Jung, KyongSoon Cho | 2016-01-19 |
| 9177904 | Chip-on-film package and device assembly including the same | Jae-Min Jung, KwanJai Lee, KyongSoon Cho, Jeong-Kyu Ha | 2015-11-03 |
| 9113545 | Tape wiring substrate and chip-on-film package including the same | Young-Shin Kwon, Kwan-Jai Lee, Jae-Min Jung, Kyong-Soon Cho, Jeong-Kyu Ha | 2015-08-18 |
| 9054228 | Semiconductor packages including a heat spreader and methods of forming the same | Eun-Kyoung Choi, Jong Youn Kim, Sang Wook Park, Hae-Jung Yu, In-Young Lee +1 more | 2015-06-09 |
| 8980689 | Method of fabricating semiconductor multi-chip stack packages | Byoung-Soo Kwak, Cha-Jea Jo, Tae-Je Cho | 2015-03-17 |
| 8940557 | Method of fabricating wafer level package | Sang Won Kim, Jong Youn Kim, Eun-Kyoung Choi, Ji-Seok Hong | 2015-01-27 |
| 8940621 | Methods of forming semiconductor modules including flexible panels | Jeong-Kyu Ha, Youngshin Kwon, Seung Hwan Kim, KwanJai Lee | 2015-01-27 |
| 8853694 | Chip on film package including test pads and semiconductor devices including the same | Jeong-Kyu Ha, Young-Shin Kwon, Seung Hwan Kim, Kwan-Jai Lee | 2014-10-07 |
| 8304876 | Semiconductor package and method for manufacturing the same | Hak-Kyoon Byun, Taehoon Kim, Jongkook Kim, Jung-Do Lee, Seonhyang You | 2012-11-06 |
| 8184449 | Electronic device having stack-type semiconductor package and method of forming the same | Jung-Do Lee, Hak-Kyoon Byun, Tae Hun Kim, Seon-Hyang You | 2012-05-22 |