Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10186500 | Semiconductor package and method of fabricating the same | Seung-Kwan Ryu, Yonghwan Kwon, Yun-Seok Choi, Taeje Cho | 2019-01-22 |
| 10121731 | Semiconductor device | Sang Cheon Park, Won-Il Lee, Taeje Cho | 2018-11-06 |
| 9875992 | Semiconductor package having stacked chips and a heat dissipation part and method of fabricating the same | Junyeong Heo, Taeje Cho | 2018-01-23 |
| 9679874 | Semiconductor package and semiconductor device including the same | Jin-Kwon Bae, Jae Choon Kim, Jichul Kim, Kyol Park | 2017-06-13 |
| 9461029 | Semiconductor packages and methods for fabricating the same | Hye-Young Jang, Chang-Seong Jeon, Taeje Cho | 2016-10-04 |
| 9355961 | Semiconductor devices having through-electrodes and methods for fabricating the same | Taeje Cho, Hyunsoo Chung | 2016-05-31 |
| 9245771 | Semiconductor packages having through electrodes and methods for fabricating the same | Hyunsoo Chung, Keum-Hee Ma, In-Young Lee, Moon Gi Cho, Taeje Cho | 2016-01-26 |
| 8802495 | Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same | Ji Hwang Kim, Tae Hong Min, Taeje Cho, Young Kun Jee, Yun-Seok Choi | 2014-08-12 |
| 8129840 | Semiconductor package and methods of manufacturing the same | Uihyoung Lee, Jae-hyun Phee, Jeong Woo Park, Ha Young Yim | 2012-03-06 |
| 8026592 | Through-silicon via structures including conductive protective layers | Minseung Yoon, Namseog Kim, Pyoungwan Kim, Keumhee Ma | 2011-09-27 |