Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6245490 | Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the same | Gi Bum Park, In Pyo Hong, Yong-Don Kim, Myung-Kee Chung | 2001-06-12 |
| 6041495 | Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the same | Gi Bum Park, In Pyo Hong, Yong-Don Kim, Myung-Kee Chung | 2000-03-28 |
| 6037662 | Chip scale package | Chung Woo Lee | 2000-03-14 |
| 5478973 | Semiconductor chip contact bump structure | Seung-Hun Chae | 1995-12-26 |
| 5291127 | Chip-lifetime testing instrument for semiconductor devices | Khee Park, Oh S. Kwon, Gi Yeong JEON | 1994-03-01 |
| 5281759 | Semiconductor package | Oh S. Kwon | 1994-01-25 |