Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7825523 | Semiconductor chip having bond pads | Young-Hee Song, Jeong-Jin Kim, Hae-Jeong Sohn, Chung Woo Lee | 2010-11-02 |
| 7576440 | Semiconductor chip having bond pads and multi-chip package | Young-Hee Song, Jeong-Jin Kim, Hae-Jeong Sohn, Chung Woo Lee | 2009-08-18 |
| 7547977 | Semiconductor chip having bond pads | Young-Hee Song, Jeong-Jin Kim, Hae-Jeong Sohn, Chung Woo Lee | 2009-06-16 |
| 7541682 | Semiconductor chip having bond pads | Young-Hee Song, Jeong-Jin Kim, Hae-Jeong Sohn, Chung Woo Lee | 2009-06-02 |
| 7453159 | Semiconductor chip having bond pads | Young-Hee Song, Jeong-Jin Kim, Hae-Jeong Sohn, Chung Woo Lee | 2008-11-18 |
| 7148578 | Semiconductor multi-chip package | Young-Hee Song, Jeong-Jin Kim, Hae-Jeong Sohn, Chung Woo Lee | 2006-12-12 |
| 6642627 | Semiconductor chip having bond pads and multi-chip package | Young-Hee Song, Jeong-Jin Kim, Hae-Jeong Sohn, Chung Woo Lee | 2003-11-04 |
| 6183589 | Method for manufacturing lead-on-chip (LOC) semiconductor packages using liquid adhesive applied under the leads | Shin Kim, Byung-Man Kim, Jeong-Ho Bang | 2001-02-06 |