Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777363 | Lead-free perovskite-based hole transport material composites, solar cells including the same, and method of manufacturing the same | Tae-Hyuk Kwon, HyeonOh Shin | 2020-09-15 |
| 10096756 | Side view light emitting diode package | Chang-Wook Kim, Yoon Suk Han, Young Jae Song, Jae Ky Roh, Seong Jae Hong | 2018-10-09 |
| 8632218 | Lighting device | Hun Yong PARK | 2014-01-21 |
| 7521788 | Semiconductor module with conductive element between chip packages | Hyo-Jae Bang, Dong-Chun Lee, Kwang-Su Yu | 2009-04-21 |
| 7338568 | Method and arrangement for attaching labels to semiconductor modules | Young-Soo Lee, Myung-Jong Eom, Dong-Chun Lee | 2008-03-04 |
| 7215026 | Semiconductor module and method of forming a semiconductor module | Chang-Yong Park, Dong-Chun Lee, Yong Hyun Kim, Kwang-Seop Kim, Dong-Woo Shin +1 more | 2007-05-08 |
| 7172106 | Printed circuit board which can be connected with pin connector and method of manufacturing the printed circuit board | Jong-Soo Choi, Joung-Rhang Lee, Chang-Yong Park | 2007-02-06 |
| 7125545 | Permanent cosmetic composition for one-step permanent operation | — | 2006-10-24 |
| 7061768 | Open socket | Dong-Chun Lee, Kwang-Su Yu, Dong-Woo Shin, Young-Soo Lee | 2006-06-13 |
| 7005735 | Array printed circuit board | Chang-Yong Park, Jong-Soo Choi, Kwang-Ho Chun, Se-Hyung Ryu | 2006-02-28 |
| 6753599 | Semiconductor package and mounting structure on substrate thereof and stack structure thereof | — | 2004-06-22 |
| 6421456 | Semiconductor wafer on which recognition marks are formed and method for sawing the wafer using the recognition marks | Dae-Woo Son, Youn Soo Lee | 2002-07-16 |
| 6183589 | Method for manufacturing lead-on-chip (LOC) semiconductor packages using liquid adhesive applied under the leads | Shin Kim, Il-Heung Choi, Jeong-Ho Bang | 2001-02-06 |
| 6121118 | Chip separation device and method | Ho Jin, In Pyo Hong, Jeong-Ho Bang | 2000-09-19 |
| 6103554 | Method for packaging integrated circuits with elastomer chip carriers | Dae-Woo Son, Youn Soo Lee | 2000-08-15 |