Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6518675 | Wafer level package and method for manufacturing the same | Dong-Hyeon Jang, Min Young Son, Sa-Yoon Kang | 2003-02-11 |
| 5621242 | Semiconductor package having support film formed on inner leads | Seung-Kon Mok, Seung Ho Ahn | 1997-04-15 |
| 5568057 | Method for performing a burn-in test | Jae Myung Park | 1996-10-22 |
| 5552635 | High thermal emissive semiconductor device package | Jong Goo Kim, Seung Ho Ahn, Jae Myung Park | 1996-09-03 |
| 5518957 | Method for making a thin profile semiconductor package | — | 1996-05-21 |
| 5504373 | Semiconductor memory module | Sang E. Oh, Seung-Kon Mok, Seung Ho Ahn | 1996-04-02 |
| 5407864 | Process for mounting a semiconductor chip and depositing contacts into through holes of a circuit board and of an insulating interposer and onto the chip | — | 1995-04-18 |
| 5356838 | Manufacturing method of a semiconductor device | — | 1994-10-18 |
| 5199164 | Method of manufacturing semiconductor package | Young Sik Kim | 1993-04-06 |
| 5186381 | Semiconductor chip bonding process | — | 1993-02-16 |
| 5157588 | Semiconductor package and manufacture thereof | Young Sik Kim | 1992-10-20 |