Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
SJ

Sang-Gui Jo — 7 Patents

Samsung: 7 patents #17,902 of 75,807Top 25%
Anmyeon-eup, KR: #76 of 671 inventorsTop 15%
Overall (All Time): #680,018 of 4,157,543Top 20%
7 Patents All Time
Sang-Gui Jo has been granted 7 US patents while listed as an inventor at Samsung. The first was granted in 2010 and the most recent in September 2014. Sang-Gui Jo ranks #680,018 of 4,157,543 US inventors in our database (top 16.4%). Patent records list Sang-Gui Jo in Anmyeon-eup, KR.

Patents per Year

Patents granted per year, 2010 to 2014Bar chart with a peak of 2 patents in 2011.peak 22010: 1 patents20102011: 2 patents20112012: 2 patents20122013: 1 patents20132014: 1 patents2014

Issued Patents All Time

Showing 1–7 of 7 patents

Patent #TitleCo-InventorsDate
8828795 Method of fabricating semiconductor package having substrate with solder ball connections Ji-Yong Park, Kwangjin Bae, Soyoung Lim 2014-09-09
8466554 Electronic device having interconnections, openings, and pads having greater width than the openings Ji-Yong Park, Hee-Seok Lee, Chul Woo Kim, Kwang-Jin Bae, Seung Hwan Kim 2013-06-18
8304892 Semiconductor package having substrate with solder ball connections and method of fabricating the same Ji-Yong Park, Kwangjin Bae, Soyoung Lim 2012-11-06
8222089 Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same Kyoung-Sei Choi, Byung-Seo Kim, Young-jae Joo, Ye-Chung Chung, Kyong-Soon Cho +6 more 2012-07-17
7952199 Circuit board including solder ball land having hole and semiconductor package having the circuit board Seung-Kon Mok, Han Shin Youn 2011-05-31
7915727 Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same Kyoung-Sei Choi, Byung-Seo Kim, Young-jae Joo, Ye-Chung Chung, Kyong-Soon Cho +6 more 2011-03-29
7667325 Circuit board including solder ball land having hole and semiconductor package having the circuit board Seung-Kon Mok, Han Shin Youn 2010-02-23