Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862548 | Package substrate film and semiconductor package including the same | Kyoungsuk YANG, Yechung Chung | 2024-01-02 |
| 10304764 | Film product, film packages and package modules using the same | Yechung Chung, Woonbae Kim, Jeong-Kyu Ha | 2019-05-28 |
| 9922891 | Film for semiconductor package, semiconductor package using film and display device including the same | Jaemin Jung, Jeong-Kyu Ha, Donghan Kim | 2018-03-20 |
| 9576865 | Film for semiconductor package, semiconductor package using film and display device including the same | Jaemin Jung, Jeong-Kyu Ha, Donghan Kim | 2017-02-21 |
| 9313889 | Display apparatus | Kyoungsuk YANG, Jeong-Kyu Ha, PaLan Lee, Narae Shin, Jae-Min Jung +1 more | 2016-04-12 |
| 8828795 | Method of fabricating semiconductor package having substrate with solder ball connections | Sang-Gui Jo, Ji-Yong Park, Kwangjin Bae | 2014-09-09 |
| 8304892 | Semiconductor package having substrate with solder ball connections and method of fabricating the same | Sang-Gui Jo, Ji-Yong Park, Kwangjin Bae | 2012-11-06 |
| 8269342 | Semiconductor packages including heat slugs | Yonghoon Kim, Heeseok Lee, Eunseok Cho, Hyuna Kim, PaLan Lee | 2012-09-18 |
