Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

US Patent 7915727 · Granted Mar 29, 2011

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Container-swappable vehicle and control method thereof2025
Door system for vehicle2025
Logistics transport system and logistics transport method including same2025
Chip-on-film package having redistribution pattern between semiconductor chip an2025
Chip-on-film package having redistribution pattern between semiconductor chip an2023
Semiconductor device2023
Semiconductor package2023
Method and apparatus for measuring endolymphatic hydrops ratio of inner ear orga2023
Semiconductor package2023
Semiconductor package including a thermal conductive layer and method of manufac2021
Gas sensing device, electronic device including the gas sensing device, and gas 2021
Semiconductor packages and display devices including the same2021