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Molded laser package with electromagnetic interference shield and method of making |
DeokKyung Yang, HunTeak Lee, HeeSoo Lee, SANGDUK LEE |
2025-04-01 |
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Semiconductor manufacturing equipment and method of providing support base with filling material disposed into openings in semiconductor wafer for support |
HyeonChul LEE, HunTeak Lee, HyunSu TAK, InHo SEO |
2024-03-19 |
| 11587882 |
Molded laser package with electromagnetic interference shield and method of making |
DeokKyung Yang, HunTeak Lee, HeeSoo Lee, SANGDUK LEE |
2023-02-21 |
| 11342294 |
Semiconductor device and method of forming protrusion e-bar for 3D SiP |
DeokKyung Yang, HunTeak Lee, OhHan Kim, HeeSoo Lee, DaeHyeok Ha |
2022-05-24 |
| 10937741 |
Molded laser package with electromagnetic interference shield and method of making |
DeokKyung Yang, HunTeak Lee, HeeSoo Lee, SANGDUK LEE |
2021-03-02 |
| 10636756 |
Semiconductor device and method of forming protrusion E-bar for 3D SIP |
DeokKyung Yang, HunTeak Lee, OhHan Kim, HeeSoo Lee, DaeHyeok Ha |
2020-04-28 |