Issued Patents All Time
Showing 26–50 of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658330 | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages | Byung Joon Han, Yaojian Lin, Pandi C. Marimuthu | 2020-05-19 |
| 10453785 | Semiconductor device and method of forming double-sided fan-out wafer level package | Pandi C. Marimuthu, Won Kyoung Choi, Sze Ping Goh, Jose Alvin Caparas | 2019-10-22 |
| 10388612 | Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits | Yaojian Lin, Byung Joon Han, Rajendra D. Pendse, Pandi C. Marimuthu, Won Kyoung Choi +1 more | 2019-08-20 |
| 10388637 | Semiconductor device and method of forming a 3D interposer system-in-package module | OhHan Kim, DeokKyung Yang, HunTeak Lee, InSang Yoon | 2019-08-20 |
| 10242948 | Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package | Jun Mo Koo, Pandi C. Marimuthu, Yaojian Lin, See Chian Lim | 2019-03-26 |
| 10217873 | Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus | Byung Joon Han, Heap Hoe Kuan | 2019-02-26 |
| 10181423 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon +1 more | 2019-01-15 |
| 10177010 | Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern | Yaojian Lin, Kang Chen, Hin Hwa Goh | 2019-01-08 |
| 10115672 | Double-sided semiconductor package and dual-mold method of making same | Pandi C. Marimuthu, Yaojian Lin | 2018-10-30 |
| 10083916 | Semiconductor device and method of forming stress relief layer between die and interconnect structure | Seng Guan Chow, Yaojian Yaojian | 2018-09-25 |
| 10049964 | Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Yu Gu | 2018-08-14 |
| 9997468 | Integrated circuit packaging system with shielding and method of manufacturing thereof | Byung Joon Han, KyoungHee Park, Yaojian Lin, KyoWang Koo, In Sang Yoon +5 more | 2018-06-12 |
| 9978665 | Semiconductor device and method of forming low profile fan-out package with vertical interconnection units | Pandi C. Marimuthu, Yaojian Lin, Won Kyoung Choi | 2018-05-22 |
| 9934998 | Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy | Byung Joon Han, Won Kyoung Choi | 2018-04-03 |
| 9893017 | Double-sided semiconductor package and dual-mold method of making same | Pandi C. Marimuthu, Yaojian Lin | 2018-02-13 |
| 9865554 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Kyung-Moon Kim, HeeJo Chi, JunMo Koo, Bartholomew Liao Chung Foh, Zigmund Ramirez Camacho | 2018-01-09 |
| 9754897 | Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits | Yaojian Lin, Byung Joon Han, Rajendra D. Pendse, Pandi C. Marimuthu, Won Kyoung Choi +1 more | 2017-09-05 |
| 9721922 | Semiconductor device and method of forming fine pitch RDL over semiconductor die in fan-out package | Pandi C. Marimuthu, Yaojian Lin, Won Kyoung Choi | 2017-08-01 |
| 9721862 | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages | Byung Joon Han, Yaojian Lin, Pandi C. Marimuthu | 2017-08-01 |
| 9704824 | Semiconductor device and method of forming embedded wafer level chip scale packages | Yaojian Lin, Pandi C. Marimuthu, Byung Joon Han | 2017-07-11 |
| 9704780 | Semiconductor device and method of forming low profile fan-out package with vertical interconnection units | Pandi C. Marimuthu, Yaojian Lin, Won Kyoung Choi | 2017-07-11 |
| 9701534 | Semiconductor device and method of forming MEMS package | Yaojian Lin | 2017-07-11 |
| 9666500 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2017-05-30 |
| 9620413 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon +1 more | 2017-04-11 |
| 9564413 | Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus | Byung Joon Han, Heap Hoe Kuan | 2017-02-07 |