Issued Patents All Time
Showing 51–75 of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9559039 | Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package | Jun Mo Koo, Pandi C. Marimuthu, Yaojian Lin, See Chian Lim | 2017-01-31 |
| 9559029 | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer | Yaojian Lin, Seng Guan Chow | 2017-01-31 |
| 9559004 | Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy | Byung Joon Han, Won Kyoung Choi | 2017-01-31 |
| 9553162 | Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus | Thomas Strothmann, Steve Anderson, Byung Joon Han, Heap Hoe Kuan | 2017-01-24 |
| 9515016 | Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant | Rui Huang, Seng Guan Chow, Heap Hoe Kuan | 2016-12-06 |
| 9508621 | Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP | Yaojian Lin, Seng Guan Chow | 2016-11-29 |
| 9331007 | Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages | InSang Yoon, Flynn Carson, SeongHun Mun | 2016-05-03 |
| 9305854 | Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package | Jun Mo Koo | 2016-04-05 |
| 9299648 | Integrated circuit packaging system with patterned substrate and method of manufacture thereof | Seng Guan Chow, Heap Hoe Kuan | 2016-03-29 |
| 9252066 | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer | Yaojian Lin, Seng Guan Chow | 2016-02-02 |
| 9202793 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Kyung-Moon Kim, HeeJo Chi, JunMo Koo, Bartholomew Liao, Zigmund Ramirez Camacho | 2015-12-01 |
| 9202769 | Semiconductor device and method of forming thermal lid for balancing warpage and thermal management | Yaojian Lin, Pandi C. Marimuthu | 2015-12-01 |
| 9177898 | Integrated circuit package system with locking terminal | Seng Guan Chow | 2015-11-03 |
| 9099455 | Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant | Seng Guan Chow, Heap Hoe Kuan, Rui Huang | 2015-08-04 |
| 9087930 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2015-07-21 |
| 9059157 | Integrated circuit packaging system with substrate and method of manufacture thereof | Yaojian Lin, JunMo Koo, Jose Alvin Caparas | 2015-06-16 |
| 9059186 | Embedded semiconductor die package and method of making the same using metal frame carrier | Seng Guan Chow, Heap Hoe Kuan | 2015-06-16 |
| 9034693 | Integrated circuit package with open substrate and method of manufacturing thereof | Kwee Lan Tan, Jian Li, Dario S. Filoteo, Jr. | 2015-05-19 |
| 9006888 | Semiconductor device and method of forming stress relief layer between die and interconnect structure | Seng Guan Chow, Yaojian Lin | 2015-04-14 |
| 9000579 | Integrated circuit package system with bonding in via | Dario S. Filoteo, Jr., Emmanuel Espiritu, Rachel Layda Abinan | 2015-04-07 |
| 8999754 | Integrated circuit package with molded cavity | Seng Guan Chow, Byung Joon Han | 2015-04-07 |
| 8993377 | Semiconductor device and method of bonding different size semiconductor die at the wafer level | Jun Mo Koo, Pandi C. Marimuthu, Seung Wook Yoon | 2015-03-31 |
| 8981548 | Integrated circuit package system with relief | Jeffrey D. Punzalan, Henry Descalzo Bathan | 2015-03-17 |
| 8957530 | Integrated circuit packaging system with embedded circuitry and post | Seng Guan Chow, Heap Hoe Kuan, Seung Uk Yoon, Jong-Woo Ha | 2015-02-17 |
| 8951834 | Methods of forming solder balls in semiconductor packages | Kyung-Moon Kim, HeeJo Chi, HanGil Shin | 2015-02-10 |