Issued Patents All Time
Showing 101–125 of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8207597 | Integrated circuit package system with flashless leads | Jeffrey D. Punzalan, Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2012-06-26 |
| 8207598 | Semiconductor package heat spreader | Virgil Ararao, Seng Guan Chow, Sheila Marie L. Alvarez | 2012-06-26 |
| 8198735 | Integrated circuit package with molded cavity | Seng Guan Chow, Byung Joon Han | 2012-06-12 |
| 8178982 | Dual molded multi-chip package system | Kambhampati Ramakrishna, Seng Guan Chow | 2012-05-15 |
| 8178392 | Electronic system with expansion feature | Haengcheol Choi, Ki Youn Jang, TaeWoo Kang | 2012-05-15 |
| 8163600 | Bridge stack integrated circuit package-on-package system | Seng Guan Chow, Byung Joon Han | 2012-04-24 |
| 8143107 | Integrated circuit packaging system substrates and method of manufacture thereof | Byung Tai Do, Seng Guan Chow | 2012-03-27 |
| 8106496 | Semiconductor packaging system with stacking and method of manufacturing thereof | Kambhampati Ramakrishna, Seng Guan Chow | 2012-01-31 |
| 8102040 | Integrated circuit package system with die and package combination | Seng Guan Chow, Ming Ying | 2012-01-24 |
| 8072059 | Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor die | Seng Guan Chow, Yaojian Lin, Rui Huang | 2011-12-06 |
| 8050047 | Integrated circuit package system with flexible substrate and recessed package | Seng Guan Chow, Byung Joon Han, Kambhampati Ramakrishna | 2011-11-01 |
| 8039303 | Method of forming stress relief layer between die and interconnect structure | Seng Guan Chow, Yaojian Lin | 2011-10-18 |
| 8034661 | Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP | Yaojian Lin, Seng Guan Chow | 2011-10-11 |
| 8031475 | Integrated circuit package system with flexible substrate and mounded package | Seng Guan Chow, Byung Joon Han, Kambhampati Ramakrishna | 2011-10-04 |
| 8030783 | Integrated circuit package with open substrate | Kwee Lan Tan, Jian Li, Dario S. Filoteo, Jr. | 2011-10-04 |
| 8021924 | Encapsulant cavity integrated circuit package system and method of fabrication thereof | Byung Joon Han, Kambhampati Ramakrishna, Seng Guan Chow | 2011-09-20 |
| 8012867 | Wafer level chip scale package system | Koo Hong Lee, Young Cheol Kim, Bongsuk Choi | 2011-09-06 |
| 7993941 | Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant | Rui Huang, Seng Guan Chow, Heap Hoe Kuan | 2011-08-09 |
| 7968377 | Integrated circuit protruding pad package system | Seng Guan Chow, Ming Ying, Roger Emigh | 2011-06-28 |
| 7960816 | Semiconductor package with passive device integration | Seng Guan Chow, Ming Ying, Byung Hoon Ahn | 2011-06-14 |
| 7947534 | Integrated circuit packaging system including a non-leaded package | Jeffrey D. Punzalan, Henry Descalzo Bathan, Keng Kiat Lau | 2011-05-24 |
| 7936053 | Integrated circuit package system with lead structures including a dummy tie bar | Jeffrey D. Punzalan, Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2011-05-03 |
| 7928540 | Integrated circuit package system | Antonio B. Dimaano, Jr., Henry Descalzo Bathan, Jeffrey D. Punzalan | 2011-04-19 |
| 7928564 | Multichip module package and fabrication method | Dario S. Filoteo, Jr., Tsz Yin Ho, Sebastian T. M. Soon | 2011-04-19 |
| 7923295 | Semiconductor device and method of forming the device using sacrificial carrier | Yaojian Lin, Seng Guan Chow | 2011-04-12 |