Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12380818 | Multi-dimensional printing method and apparatus | David Eric Schwartz | 2025-08-05 |
| 12020596 | Multi-dimensional printing method and apparatus | David Eric Schwartz | 2024-06-25 |
| 7947534 | Integrated circuit packaging system including a non-leaded package | Jeffrey D. Punzalan, Henry Descalzo Bathan, Il Kwon Shim | 2011-05-24 |
| 7683461 | Integrated circuit leadless package system | — | 2010-03-23 |
| 7338841 | Leadframe with encapsulant guide and method for the fabrication thereof | — | 2008-03-04 |
| 7298026 | Large die package and method for the fabrication thereof | Il Kwon Shim, Jeffrey D. Punzalan | 2007-11-20 |
| 6505928 | Methods and apparatus for ink jet printing with forced air drying | Arthur Landau, Clement N. Onyenemezu | 2003-01-14 |