Issued Patents All Time
Showing 126–150 of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7901996 | Integrated circuit package system with interconnection support and method of manufacture thereof | Henry Descalzo Bathan, Jeffrey D. Punzalan, Zigmund Ramirez Camacho | 2011-03-08 |
| 7892894 | Method of manufacturing integrated circuit package system with warp-free chip | Byung Tai Do, Antonio B. Dimaano, Jr., Heap Hoe Kuan | 2011-02-22 |
| 7888184 | Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof | Seng Guan Chow, Heap Hoe Kuan, Seung Uk Yoon, Jong-Woo Ha | 2011-02-15 |
| 7863108 | Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof | Antonio B. Dimaano, Jr., Sheila Rima C. Magno | 2011-01-04 |
| 7863730 | Array-molded package heat spreader and fabrication method therefor | Kambhampati Ramakrishna, Diane Sahakian, Seng Guan Chow, Dario S. Filoteo, Jr., Virgil Ararao | 2011-01-04 |
| 7855100 | Integrated circuit package system with an encapsulant cavity and method of fabrication thereof | Byung Joon Han, Kambhampati Ramakrishna, Seng Guan Chow | 2010-12-21 |
| 7842542 | Embedded semiconductor die package and method of making the same using metal frame carrier | Seng Guan Chow, Heap Hoe Kuan | 2010-11-30 |
| 7838337 | Semiconductor device and method of forming an interposer package with through silicon vias | Pandi C. Marimuthu, Nathapong Suthiwongsunthorn, Kock Liang Heng | 2010-11-23 |
| 7786593 | Integrated circuit die with pedestal | Virgil Ararao, Seng Guan Chow | 2010-08-31 |
| 7767496 | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer | Yaojian Lin, Seng Guan Chow | 2010-08-03 |
| 7746656 | Offset integrated circuit package-on-package stacking system | Byung Joon Han, Seng Guan Chow | 2010-06-29 |
| 7732907 | Integrated circuit package system with edge connection system | Byung Joon Han, Seng Guan Chow | 2010-06-08 |
| 7701049 | Integrated circuit packaging system for fine pitch substrates | Byung Tai Do, Seng Guan Chow | 2010-04-20 |
| 7626277 | Integrated circuit package with open substrate | Kwee Lan Tan, Jian Li, Dario S. Filoteo, Jr. | 2009-12-01 |
| 7622800 | Stacked semiconductor packages and method therefor | Kambhampati Ramakrishna, Seng Guan Chow | 2009-11-24 |
| 7622325 | Integrated circuit package system including high-density small footprint system-in-package | Tsz Yin Ho, Dario S. Filoteo, Jr., Seng Guan Chow | 2009-11-24 |
| 7622333 | Integrated circuit package system for package stacking and manufacturing method thereof | Young Cheol Kim, Koo Hong Lee, Jae Hak Yee | 2009-11-24 |
| 7598606 | Integrated circuit package system with die and package combination | Seng Guan Chow, Ming Ying | 2009-10-06 |
| 7598599 | Semiconductor package system with substrate having different bondable heights at lead finger tips | Seng Guan Chow, Ming Ying, Lip Seng Tan | 2009-10-06 |
| 7575956 | Fabrication method for semiconductor package heat spreaders | Virgil Ararao, Seng Guan Chow, Sheila Marie L. Alvarez | 2009-08-18 |
| 7563647 | Integrated circuit package system with interconnect support | Henry Descalzo Bathan, Jeffrey D. Punzalan, Zigmund Ramirez Camacho | 2009-07-21 |
| 7556987 | Method of fabricating an integrated circuit with etched ring and die paddle | Antonio B. Dimaano, Jr., Sheila Rima C. Magno | 2009-07-07 |
| 7554179 | Multi-leadframe semiconductor package and method of manufacture | Seng Guan Chow, Jeffrey D. Punzalan, Pandi C. Marimuthu | 2009-06-30 |
| 7518224 | Offset integrated circuit package-on-package stacking system | Byung Joon Han, Seng Guan Chow | 2009-04-14 |
| 7498665 | Integrated circuit leadless package system | Leocadio Morona Alabin, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2009-03-03 |