Issued Patents All Time
Showing 151–175 of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7479692 | Integrated circuit package system with heat sink | Antonio B. Dimaano, Jr., Henry Descalzo Bathan, Jeffrey D. Punzalan | 2009-01-20 |
| 7446408 | Semiconductor package with heat sink | Seng Guan Chow, Gerry Balanon | 2008-11-04 |
| 7445955 | Multichip module package and fabrication method | Dario S. Filoteo, Jr., Tsz Yin Ho, Sebastian T. M. Soon | 2008-11-04 |
| 7435619 | Method of fabricating a 3-D package stacking system | Byung Joon Han, Seng Guan Chow | 2008-10-14 |
| 7429787 | Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides | Marcos Karnezos, Byung Joon Han, Kambhampati Ramakrishna, Seng Guan Chow | 2008-09-30 |
| 7420265 | Integrated circuit package system with integrated circuit support | Henry Descalzo Bathan, Jeffrey D. Punzalan, Zigmund Ramirez Camacho | 2008-09-02 |
| 7414318 | Etched leadframe flipchip package system | Sheila Marie L. Alvarez, Hin Hwa Goh, Robinson Quiazon | 2008-08-19 |
| 7399658 | Pre-molded leadframe and method therefor | Diane Sahakian, Kambhampati Ramakrishna, Seng Guan Chow | 2008-07-15 |
| 7400049 | Integrated circuit package system with heat sink | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Jeffrey D. Punzalan | 2008-07-15 |
| 7388280 | Package stacking lead frame system | Ming Ying, Seng Guan Chow | 2008-06-17 |
| 7378300 | Integrated circuit package system | Pandi C. Marimuthu | 2008-05-27 |
| 7372141 | Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides | Marcos Karnezos, Byung Joon Han, Kambhampati Ramakrishna, Seng Guan Chow | 2008-05-13 |
| 7364945 | Method of mounting an integrated circuit package in an encapsulant cavity | Byung Joon Han, Kambhampati Ramakrishna, Seng Guan Chow | 2008-04-29 |
| 7352055 | Semiconductor package with controlled solder bump wetting | Sheila Marie L. Alvarez, Sheila Rima C. Magno | 2008-04-01 |
| 7327025 | Heat spreader for thermally enhanced semiconductor package | Sheila Marie L. Alvarez, Virgil Ararao | 2008-02-05 |
| 7309913 | Stacked semiconductor packages | Kambhampati Ramakrishna, Seng Guan Chow, Byung Joon Han | 2007-12-18 |
| 7298026 | Large die package and method for the fabrication thereof | Jeffrey D. Punzalan, Keng Kiat Lau | 2007-11-20 |
| 7274089 | Integrated circuit package system with adhesive restraint | Jeffrey D. Punzalan, Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2007-09-25 |
| 7250685 | Etched leadframe flipchip package system | Sheila Marie L. Alvarez, Hin Hwa Goh, Robinson Quiazon | 2007-07-31 |
| 7242101 | Integrated circuit die with pedestal | Virgil Ararao, Seng Guan Chow | 2007-07-10 |
| 7242091 | Stacked semiconductor packages and method therefor | Kambhampati Ramakrishna, Seng Guan Chow | 2007-07-10 |
| 7211900 | Thin semiconductor package including stacked dies | Won Sun Shin, Do Sung Chun, Seon Goo Lee, Vincent DiCaprio | 2007-05-01 |
| 7169641 | Semiconductor package with selective underfill and fabrication method therfor | Sheila Marie L. Alvarez, Romeo Emmanuel P. Alvarez | 2007-01-30 |
| 7153725 | Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor | Tie Wang, Virgil Ararao, Sheila Marie L. Alvarez | 2006-12-26 |
| 7148086 | Semiconductor package with controlled solder bump wetting and fabrication method therefor | Sheila Marie L. Alvarez, Sheila Rima C. Magno | 2006-12-12 |