Issued Patents All Time
Showing 201–210 of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6414396 | Package for stacked integrated circuits | Vincent DiCaprio, Paul R. Hoffman, Byung Joon Han | 2002-07-02 |
| 6021563 | Marking Bad printed circuit boards for semiconductor packages | Young Wook Heo | 2000-02-08 |
| 6020218 | Method of manufacturing ball grid array semiconductor package | Sun Ho Ha | 2000-02-01 |
| 5953589 | Ball grid array semiconductor package with solder balls fused on printed circuit board and method for fabricating the same | Young Wook Heo, Robert Francis Darreaux | 1999-09-14 |
| 5864470 | Flexible circuit board for ball grid array semiconductor package | Young Wook Heo, Robert Francis Darveaux | 1999-01-26 |
| 5854741 | Unit printed circuit board carrier frame for ball grid array semiconductor packages and method for fabricating ball grid array semiconductor packages using the same | Young Wook Heo | 1998-12-29 |
| 5729432 | Ball grid array semiconductor package with improved heat dissipation and dehumidification effect | Young Wook Heo | 1998-03-17 |
| 5708567 | Ball grid array semiconductor package with ring-type heat sink | Young Wook Heo | 1998-01-13 |
| 5641946 | Method and circuit board structure for leveling solder balls in ball grid array semiconductor packages | — | 1997-06-24 |
| 5635671 | Mold runner removal from a substrate-based packaged electronic device | Bruce J. Freyman, John Briar, Young Wook Heo | 1997-06-03 |