Issued Patents All Time
Showing 176–200 of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7064430 | Stacked die packaging and fabrication method | Seng Guan Chow, Ming Ying, Roger Emigh | 2006-06-20 |
| 7008820 | Chip scale package with open substrate | Kwee Lan Tan, Jian Li, Dario S. Filoteo, Jr. | 2006-03-07 |
| 7005325 | Semiconductor package with passive device integration | Seng Guan Chow, Ming Ying, Byung Hoon Ahn | 2006-02-28 |
| 6982488 | Semiconductor package and method for fabricating the same | Won Sun Shin, Do Sung Chun, Soon Goo Lee, Vincent DiCaprio | 2006-01-03 |
| 6979907 | Integrated circuit package | Jian Li, Guruprasad G. Badakere | 2005-12-27 |
| 6960493 | Semiconductor device package | Virgil Ararao, Hermes T. Apale | 2005-11-01 |
| 6943057 | Multichip module package and fabrication method | Dario S. Filoteo, Jr., Tsz Yin Ho, Sebastian T. M. Soon | 2005-09-13 |
| 6875634 | Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same | Hermes T. Apale, Weddie Aquien, Dario S. Filoteo, Jr., Virgil Ararao, Leo A. Merilo | 2005-04-05 |
| 6861288 | Stacked semiconductor packages and method for the fabrication thereof | Kambhampati Ramakrishna, Seng Guan Chow, Byung Joon Han | 2005-03-01 |
| 6855573 | Integrated circuit package and manufacturing method therefor with unique interconnector | Jian Li, Guruprasad G. Badakere | 2005-02-15 |
| 6841858 | Leadframe for die stacking applications and related die stacking concepts | Kambhampati Ramakrishna, Seng Guan Chow | 2005-01-11 |
| 6825067 | Mold cap anchoring method for molded flex BGA packages | Virgil Ararao, Hermes T. Apale | 2004-11-30 |
| 6818981 | Heat spreader interconnect for thermally enhanced PBGA packages | Hermes T. Apale, Gerry Balanon | 2004-11-16 |
| 6802445 | Cost effective substrate fabrication for flip-chip packages | Jian Li, Sheila Marie L. Alvarez | 2004-10-12 |
| 6798049 | Semiconductor package and method for fabricating the same | Won Sun Shin, Do Sung Chun, Seon Goo Lee, Vincent DiCaprio | 2004-09-28 |
| 6775140 | Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices | Seng Guan Chow, Virgil Ararao, Sheila Marie L. Alvarez, Roger Emigh | 2004-08-10 |
| 6737298 | Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same | Hermes T. Apale, Weddle Aquien, Dario S. Filoteo, Jr., Virgil Ararao, Leo A. Merilo | 2004-05-18 |
| 6706563 | Heat spreader interconnect methodology for thermally enhanced PBGA packages | Hermes T. Apale, Gerry Balanon | 2004-03-16 |
| 6683377 | Multi-stacked memory package | Vincent DiCaprio | 2004-01-27 |
| 6627990 | Thermally enhanced stacked die package | Kambhampati Ramakrishna, Seng Gaun Chow | 2003-09-30 |
| 6599779 | PBGA substrate for anchoring heat sink | Seng Guan Chow, Gerry Balanon | 2003-07-29 |
| 6534859 | Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package | Seng Guan Chow, Gerry Balanon | 2003-03-18 |
| 6531784 | Semiconductor package with spacer strips | Kambhampati Ramakrishna, Vincent DiCaprio | 2003-03-11 |
| 6489667 | Semiconductor device and method of manufacturing such device | Chang Kyu Park, Byung Joon Han, Vincent DiCaprio, Paul R. Hoffman | 2002-12-03 |
| 6462274 | Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages | Chang Kyu Park, Byung Joon Han, Vincent DiCaprio, Paul R. Hoffman | 2002-10-08 |