Issued Patents All Time
Showing 76–100 of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8912648 | Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP | Yaojian Lin, Seng Guan Chow | 2014-12-16 |
| 8846454 | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer | Yaojian Lin, Seng Guan Chow | 2014-09-30 |
| 8759155 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2014-06-24 |
| 8703541 | Electronic system with expansion feature | Haengcheol Choi, Ki Youn Jang, TaeWoo Kang | 2014-04-22 |
| 8685792 | Integrated circuit package system with interposer | Seng Guan Chow | 2014-04-01 |
| 8659113 | Embedded semiconductor die package and method of making the same using metal frame carrier | Seng Guan Chow, Heap Hoe Kuan | 2014-02-25 |
| 8643163 | Integrated circuit package-on-package stacking system and method of manufacture thereof | Byung Joon Han, Seng Guan Chow | 2014-02-04 |
| 8604602 | Integrated circuit packaging system with reinforced encapsulant having embedded interconnect and method of manufacture thereof | Seng Guan Chow, Heap Hoe Kuan, Youngcheol Kim | 2013-12-10 |
| 8587098 | Integrated circuit protruding pad package system and method for manufacturing thereof | Seng Guan Chow, Ming Ying, Roger Emigh | 2013-11-19 |
| 8581375 | Leadframe-based mold array package heat spreader and fabrication method therefor | Kambhampati Ramakrishna, Diane Sahakian | 2013-11-12 |
| 8569872 | Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Philip Lyndon Cablao, Jose Alvin Caparas | 2013-10-29 |
| 8558399 | Dual molded multi-chip package system | Kambhampati Ramakrishna, Seng Guan Chow | 2013-10-15 |
| 8536689 | Integrated circuit package system with multi-surface die attach pad | Antonio B. Dimaano, Jr., Sheila Rima C. Magno, Dennis Guillermo | 2013-09-17 |
| 8456002 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2013-06-04 |
| 8421202 | Integrated circuit packaging system with flex tape and method of manufacture thereof | Seng Guan Chow, Heap Hoe Kuan | 2013-04-16 |
| 8421197 | Integrated circuit package system with warp-free chip | Byung Tai Do, Antonio B. Dimaano, Jr., Heap Hoe Kuan | 2013-04-16 |
| 8409920 | Integrated circuit package system for package stacking and method of manufacture therefor | Rajendra D. Pendse, Flynn Carson, Seng Guan Chow | 2013-04-02 |
| 8399968 | Non-leaded integrated circuit package system | Jeffrey D. Punzalan, Henry Descalzo Bathan | 2013-03-19 |
| 8395251 | Integrated circuit package to package stacking system | Seng Guan Chow, Jeffrey D. Punzalan, Byung Joon Han, Kambhampati Ramakrishna | 2013-03-12 |
| 8354746 | Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant | Rui Huang, Seng Guan Chow, Heap Hoe Kuan | 2013-01-15 |
| 8354304 | Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant | Seng Guan Chow, Heap Hoe Kuan, Rui Huang | 2013-01-15 |
| 8309397 | Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof | Byung Joon Han, Kambhampati Ramakrishna, Seng Guan Chow | 2012-11-13 |
| 8263439 | Semiconductor device and method of forming an interposer package with through silicon vias | Pandi C. Marimuthu, Nathapong Suthiwongsunthorn, Kock Liang Heng | 2012-09-11 |
| 8222717 | Embedded semiconductor die package and method of making the same using metal frame carrier | Seng Guan Chow, Heap Hoe Kuan | 2012-07-17 |
| 8211753 | Leadframe-based mold array package heat spreader and fabrication method therefor | Kambhampati Ramakrishna, Diane Sahakian | 2012-07-03 |