Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8354297 | Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die | Reza A. Pagaila, Seng Guan Chow | 2013-01-15 |
| 7888184 | Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof | Il Kwon Shim, Seng Guan Chow, Heap Hoe Kuan, Jong-Woo Ha | 2011-02-15 |
| 7786008 | Integrated circuit packaging system having through silicon vias with partial depth metal fill regions and method of manufacture thereof | Byung Tai Do, Seng Guan Chow | 2010-08-31 |
| 7592703 | RF and MMIC stackable micro-modules | Vaidyanathan Kripesh, Mihai Rotaru, Ganesh Vetrivel Periasamy, Ranganathan Nagarajan | 2009-09-22 |
| 7230318 | RF and MMIC stackable micro-modules | Vaidyanathan Kripesh, Mihai Rotaru, Ganesh Vetrivel Periasamy, Ranganathan Nagarajan | 2007-06-12 |