Issued Patents All Time
Showing 51–75 of 192 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9142431 | Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking | — | 2015-09-22 |
| 9093364 | Integrated circuit packaging system with exposed vertical interconnects and method of manufacture thereof | — | 2015-07-28 |
| 9076803 | Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure | — | 2015-07-07 |
| 9064876 | Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP | Heap Hoe Kuan, Dioscoro A. Merilo | 2015-06-23 |
| 9059011 | Exposed interconnect for a package on package system | Byung Tai Do, Linda Pei Ee Chua | 2015-06-16 |
| 9054095 | Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers | — | 2015-06-09 |
| 9048211 | Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation | Byung Tai Do, Linda Pei Ee Chua | 2015-06-02 |
| 9030006 | Integrated circuit package system with internal stacking module | Seng Guan Chow, Heap Hoe Kuan | 2015-05-12 |
| 9029205 | Integrated circuit packaging system having planar interconnect and method for manufacture thereof | Byung Tai Do, Heap Hoe Kuan | 2015-05-12 |
| 9006882 | Semiconductor device and method of forming recessed conductive vias in saw streets | Byung Tai Do, Heap Hoe Kuan | 2015-04-14 |
| 8999760 | Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure | Yaojian Lin, Jun Mo Koo | 2015-04-07 |
| 8994184 | Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of FO-WLCSP | — | 2015-03-31 |
| 8969136 | Integrated circuit packaging system for electromagnetic interference shielding and method of manufacture thereof | — | 2015-03-03 |
| 8962393 | Integrated circuit packaging system with heat shield and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2015-02-24 |
| 8946870 | Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die | Byung Tai Do, Linda Pei Ee Chua | 2015-02-03 |
| 8940636 | Through hole vias at saw streets including protrusions or recesses for interconnection | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Byung Tai Do | 2015-01-27 |
| 8916452 | Semiconductor device and method of forming WLCSP using wafer sections containing multiple die | Yaojian Lin | 2014-12-23 |
| 8907498 | Semiconductor device and method of forming a shielding layer between stacked semiconductor die | Byung Tai Do, Nathapong Suthiwongsunthorn | 2014-12-09 |
| 8896109 | Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die | Seng Guan Chow, Seung Uk Yoon | 2014-11-25 |
| 8883559 | Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP | Yaojian Lin | 2014-11-11 |
| 8866294 | Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation | Yaojian Lin, Jun Mo Koo | 2014-10-21 |
| 8861221 | Integrated circuit packaging system with a shield and method of manufacture thereof | — | 2014-10-14 |
| 8822281 | Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier | Yaojian Lin, Seung Uk Yoon | 2014-09-02 |
| 8823182 | Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant | Linda Pei Ee Chua, Byung Tai Do | 2014-09-02 |
| 8815650 | Integrated circuit packaging system with formed under-fill and method of manufacture thereof | — | 2014-08-26 |