Issued Patents All Time
Showing 101–125 of 192 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8518746 | Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die | Yaojian Lin, Seung Uk Yoon | 2013-08-27 |
| 8519518 | Integrated circuit packaging system with lead encapsulation and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua, Arnel Senosa Trasporto | 2013-08-27 |
| 8501541 | Semiconductor device and method of conforming conductive vias between insulating layers in saw streets | Linda Pei Ee Chua, Byung Tai Do | 2013-08-06 |
| 8502352 | Semiconductor device with conductive vias between saw streets | Linda Pei Ee Chua, Byung Tai Do | 2013-08-06 |
| 8501544 | Semiconductor device and method of forming adhesive material over semiconductor die and carrier to reduce die shifting during encapsulation | — | 2013-08-06 |
| 8492196 | Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die | Yaojian Lin | 2013-07-23 |
| 8492201 | Semiconductor device and method of forming through vias with reflowed conductive material | Linda Pei Ee Chua, Byung Tai Do | 2013-07-23 |
| 8482115 | Integrated circuit packaging system with dual side connection and method of manufacture thereof | — | 2013-07-09 |
| 8476772 | Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die | Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua | 2013-07-02 |
| 8466544 | Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP | — | 2013-06-18 |
| 8466057 | Integrated circuit packaging system with filled vias and method of manufacture thereof | Linda Pei Ee Chua, Byung Tai Do | 2013-06-18 |
| 8435834 | Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSP | Rajendra D. Pendse, Jun Mo Koo | 2013-05-07 |
| 8435835 | Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die | Dioscoro A. Merilo | 2013-05-07 |
| 8436439 | Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure | Rui Huang, Yaojian Lin | 2013-05-07 |
| 8420950 | Circuit system with leads and method of manufacture thereof | Seng Guan Chow, Heap Hoe Kuan | 2013-04-16 |
| 8409978 | Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe | KiYoun Jang, HunTeak Lee | 2013-04-02 |
| 8406004 | Integrated circuit packaging system and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2013-03-26 |
| 8404518 | Integrated circuit packaging system with package stacking and method of manufacture thereof | Byung Tai Do, Rui Huang | 2013-03-26 |
| 8389330 | Integrated circuit package system with package stand-off and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2013-03-05 |
| 8383457 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Seng Guan Chow, Seung Uk Yoon | 2013-02-26 |
| 8378477 | Integrated circuit packaging system with film encapsulation and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2013-02-19 |
| 8378383 | Semiconductor device and method of forming a shielding layer between stacked semiconductor die | Byung Tai Do, Nathapong Suthiwongsunthorn | 2013-02-19 |
| 8368187 | Semiconductor device and method of forming air gap adjacent to stress sensitive region of the die | — | 2013-02-05 |
| 8367480 | Semiconductor device and method of forming dam material around periphery of die to reduce warpage | — | 2013-02-05 |
| 8367470 | Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die | — | 2013-02-05 |