Issued Patents All Time
Showing 76–100 of 192 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8810011 | Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer | — | 2014-08-19 |
| 8796137 | Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect | Yaojian Lin, Jun Mo Koo | 2014-08-05 |
| 8790962 | Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure | Rui Huang, Yaojian Lin | 2014-07-29 |
| 8791015 | Semiconductor device and method of forming shielding layer over active surface of semiconductor die | — | 2014-07-29 |
| 8742579 | Semiconductor device and method of providing Z-interconnect conductive pillars with inner polymer core | Byung Tai Do, Shuangwu Huang | 2014-06-03 |
| 8729694 | Semiconductor device and method of forming conductive vias with trench in saw street | Byung Tai Do | 2014-05-20 |
| 8710635 | Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die | Jose Alvin Caparas, Pandi C. Marimuthu | 2014-04-29 |
| 8703610 | Semiconductor device and method of forming conductive TSV with insulating annular ring | Byung Tai Do, Nathapong Suthiwongsunthorn | 2014-04-22 |
| 8648448 | Semiconductor device and method of shielding semiconductor die from inter-device interference | Byung Tai Do, Heap Hoe Kuan, Rui Huang | 2014-02-11 |
| 8642382 | Integrated circuit packaging system with support structure and method of manufacture thereof | Heap Hoe Kuan, Rui Huang | 2014-02-04 |
| 8642381 | Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die | DaeSik Choi, Jun Mo Koo | 2014-02-04 |
| 8633059 | Integrated circuit packaging system with interconnect and method of manufacture thereof | Byung Tai Do | 2014-01-21 |
| 8623702 | Semiconductor device and method of forming conductive THV and RDL on opposite sides of semiconductor die for RDL-to-RDL bonding | — | 2014-01-07 |
| 8592975 | Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure | — | 2013-11-26 |
| 8592950 | Semiconductor device and method of forming through vias with reflowed conductive material | Linda Pei Ee Chua, Byung Tai Do | 2013-11-26 |
| 8581370 | Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die | Yaojian Lin | 2013-11-12 |
| 8575769 | Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation | Byung Tai Do, Linda Pei Ee Chua | 2013-11-05 |
| 8574960 | Semiconductor device and method of forming cavity adjacent to sensitive region of semiconductor die using wafer-level underfill material | Byung Tai Do, Linda Pei Ee Chua | 2013-11-05 |
| 8563418 | Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces | KiYoun Jang, HunTeak Lee | 2013-10-22 |
| 8558392 | Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant | Linda Pei Ee Chua, Byung Tai Do | 2013-10-15 |
| 8557639 | Apparatus for thermally enhanced semiconductor package | Byung Tai Do, Zigmund Ramirez Camacho | 2013-10-15 |
| 8546193 | Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure | Byung Tai Do, Linda Pei Ee Chua | 2013-10-01 |
| 8531043 | Planar encapsulation and mold cavity package in package system | Jong-Woo Ha | 2013-09-10 |
| 8530274 | Semiconductor device and method of forming air gap adjacent to stress sensitive region of the die | — | 2013-09-10 |
| 8525344 | Semiconductor device and method of forming bond wires between semiconductor die contact pads and conductive TOV in peripheral area around semiconductor die | Byung Tai Do, Dioscoro A. Merilo | 2013-09-03 |