Issued Patents All Time
Showing 76–83 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7777310 | Integrated circuit package system with integral inner lead and paddle | Jeffrey D. Punzalan, Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2010-08-17 |
| 7759806 | Integrated circuit package system with multiple device units | Lionel Chien Hui Tay, Zigmund Ramirez Camacho, Jeffrey D. Punzalan | 2010-07-20 |
| 7750451 | Multi-chip package system with multiple substrates | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2010-07-06 |
| 7671463 | Integrated circuit package system with ground ring | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2010-03-02 |
| 7541221 | Integrated circuit package system with leadfinger support | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Jeffrey D. Punzalan | 2009-06-02 |
| 7449369 | Integrated circuit package system with multiple molding | Zigmund Ramirez Camacho, Jose Alvin Caparas, Jeffrey D. Punzalan | 2008-11-11 |
| 7365417 | Overhang integrated circuit package system | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2008-04-29 |
| 6380048 | Die paddle enhancement for exposed pad in semiconductor packaging | Tan Boon, Zheng Zheng | 2002-04-30 |