TB

Tan Boon

SP St Assembly Test Services Pte: 1 patents #25 of 50Top 50%
UC United Test And Assembly Center: 1 patents #30 of 65Top 50%
Overall (All Time): #2,182,180 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6921974 Packaged device with thermal enhancement and method of packaging Liu Hao, Park Soo Gil 2005-07-26
6380048 Die paddle enhancement for exposed pad in semiconductor packaging Zheng Zheng, Arnel Senosa Trasporto 2002-04-30