Issued Patents All Time
Showing 26–50 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8937379 | Integrated circuit packaging system with trenched leadframe and method of manufacture thereof | Byung Tai Do, Asri Yusof, Linda Pei Ee Chua | 2015-01-20 |
| 8866248 | Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2014-10-21 |
| 8841173 | Integrated circuit packaging system with leadframe lead array routing and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2014-09-23 |
| 8802501 | Integrated circuit packaging system with island terminals and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Emmanuel Espiritu, Byung Tai Do, Linda Pei Ee Chua | 2014-08-12 |
| 8791556 | Integrated circuit packaging system with routable circuitry and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2014-07-29 |
| 8786063 | Integrated circuit packaging system with leads and transposer and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2014-07-22 |
| 8779565 | Integrated circuit mounting system with paddle interlock and method of manufacture thereof | Byung Joon Han, Byung Tai Do, Henry Descalzo Bathan | 2014-07-15 |
| 8759159 | Integrated circuit packaging system with electrical interface and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2014-06-24 |
| 8735224 | Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof | Byung Tai Do, Zigmund Ramirez Camacho | 2014-05-27 |
| 8729693 | Integrated circuit packaging system with a leaded package and method of manufacture thereof | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan | 2014-05-20 |
| 8698294 | Integrated circuit package system including wide flange leadframe | Zigmund Ramirez Camacho, Jose Alvin Caparas, Jeffrey D. Punzalan | 2014-04-15 |
| 8669654 | Integrated circuit packaging system with die paddle and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2014-03-11 |
| 8664038 | Integrated circuit packaging system with stacked paddle and method of manufacture thereof | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jose Alvin Caparas | 2014-03-04 |
| 8658470 | Integrated circuit packaging system with formed interconnects and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2014-02-25 |
| 8637394 | Integrated circuit package system with flex bump | Jairus Legaspi Pisigan, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2014-01-28 |
| 8633578 | Integrated circuit package system with laminate base | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2014-01-21 |
| 8633063 | Integrated circuit packaging system with pad connection and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2014-01-21 |
| 8629537 | Padless die support integrated circuit package system | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2014-01-14 |
| 8629567 | Integrated circuit packaging system with contacts and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2014-01-14 |
| 8623708 | Integrated circuit packaging system with grid-array mechanism and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2014-01-07 |
| 8623711 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2014-01-07 |
| 8592252 | Semiconductor device and method of forming through hole vias in die extension region around periphery of die | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2013-11-26 |
| 8569112 | Integrated circuit packaging system with encapsulation and leadframe etching and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2013-10-29 |
| 8557638 | Integrated circuit packaging system with pad connection and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2013-10-15 |
| 8525325 | Integrated circuit packaging system with leads and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2013-09-03 |