Issued Patents All Time
Showing 26–50 of 159 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8936971 | Integrated circuit packaging system with die paddles and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu | 2015-01-20 |
| 8921983 | Semiconductor package and method of forming similar structure for top and bottom bonding pads | Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2014-12-30 |
| 8912046 | Integrated circuit packaging system with lead frame and method of manufacture thereof | Emmanuel Espiritu, Zigmund Ramirez Camacho | 2014-12-16 |
| 8872320 | Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan | 2014-10-28 |
| 8866275 | Leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Emmanuel Espiritu | 2014-10-21 |
| 8866248 | Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2014-10-21 |
| 8810017 | Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Lionel Chien Hui Tay | 2014-08-19 |
| 8810015 | Integrated circuit packaging system with high lead count and method of manufacture thereof | Zigmund Ramirez Camacho, Frederick R. Dahilig | 2014-08-19 |
| 8809119 | Integrated circuit packaging system with plated leads and method of manufacture thereof | Emmanuel Espiritu, Byung Tai Do | 2014-08-19 |
| 8802555 | Integrated circuit packaging system with interconnects and method of manufacture thereof | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Rachel Layda Abinan | 2014-08-12 |
| 8802505 | Semiconductor device and method of forming a protective layer on a backside of the wafer | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan | 2014-08-12 |
| 8802501 | Integrated circuit packaging system with island terminals and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu, Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua | 2014-08-12 |
| 8803300 | Integrated circuit packaging system with protective coating and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu, Jeffrey D. Punzalan | 2014-08-12 |
| 8786063 | Integrated circuit packaging system with leads and transposer and method of manufacture thereof | Zigmund Ramirez Camacho, Arnel Senosa Trasporto | 2014-07-22 |
| 8779565 | Integrated circuit mounting system with paddle interlock and method of manufacture thereof | Byung Joon Han, Byung Tai Do, Arnel Senosa Trasporto | 2014-07-15 |
| 8766428 | Integrated circuit packaging system with flip chip and method of manufacture thereof | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan | 2014-07-01 |
| 8729693 | Integrated circuit packaging system with a leaded package and method of manufacture thereof | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Lionel Chien Hui Tay | 2014-05-20 |
| 8723338 | Integrated circuit packaging system with array contacts and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu | 2014-05-13 |
| 8723324 | Integrated circuit packaging system with pad connection and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu, Dioscoro A. Merilo | 2014-05-13 |
| 8722457 | System and apparatus for wafer level integration of components | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Lionel Chien Hui Tay | 2014-05-13 |
| 8692377 | Integrated circuit packaging system with plated leads and method of manufacture thereof | Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2014-04-08 |
| 8669649 | Integrated circuit packaging system with interlock and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu | 2014-03-11 |
| 8652881 | Integrated circuit package system with anti-peel contact pads | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan | 2014-02-18 |
| 8643166 | Integrated circuit packaging system with leads and method of manufacturing thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu | 2014-02-04 |
| 8637394 | Integrated circuit package system with flex bump | Jairus Legaspi Pisigan, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2014-01-28 |