HB

Henry Descalzo Bathan

SC Stats Chippac: 153 patents #6 of 425Top 2%
SE Semtech: 5 patents #20 of 201Top 10%
SS St Assembly Test Services: 1 patents #36 of 63Top 60%
📍 Thousand Oaks, CA: #2 of 1,766 inventorsTop 1%
🗺 California: #886 of 386,348 inventorsTop 1%
Overall (All Time): #5,464 of 4,157,543Top 1%
159
Patents All Time

Issued Patents All Time

Showing 51–75 of 159 patents

Patent #TitleCo-InventorsDate
8633578 Integrated circuit package system with laminate base Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jeffrey D. Punzalan 2014-01-21
8629537 Padless die support integrated circuit package system Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jeffrey D. Punzalan 2014-01-14
8617933 Integrated circuit packaging system with interlock and method of manufacture thereof Zigmund Ramirez Camacho, Emmanuel Espiritu, Dioscoro A. Merilo 2013-12-31
8604596 Integrated circuit packaging system with locking interconnects and method of manufacture thereof Zigmund Ramirez Camacho, Emmanuel Espiritu 2013-12-10
8592252 Semiconductor device and method of forming through hole vias in die extension region around periphery of die Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Arnel Senosa Trasporto 2013-11-26
8586422 Optical semiconductor device having pre-molded leadframe with window and method therefor Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Amel Senosa Trasporto 2013-11-19
8569872 Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation Il Kwon Shim, Zigmund Ramirez Camacho, Philip Lyndon Cablao, Jose Alvin Caparas 2013-10-29
8558369 Integrated circuit packaging system with interconnects and method of manufacture thereof Zigmund Ramirez Camacho, Frederick Rodriguez Gahilig, Jairus Legaspi Pisigan 2013-10-15
8546189 Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jeffrey D. Punzalan, Dioscoro A. Merilo 2013-10-01
8536690 Integrated circuit packaging system with cap layer and method of manufacture thereof Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Guruprasad Badakere Govindaiah 2013-09-17
8508026 Integrated circuit packaging system with connection supports and method of manufacture thereof Zigmund Ramirez Camacho, Emmanuel Espiritu 2013-08-13
8502371 Integrated circuit package system with extended corner leads Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jairus Legaspi Pisigan 2013-08-06
8502358 Integrated circuit packaging system with multi-row leads and method of manufacture thereof Zigmund Ramirez Camacho, Emmanuel Espiritu 2013-08-06
8502357 Integrated circuit packaging system with shaped lead and method of manufacture thereof Zigmund Ramirez Camacho, Emmanuel Espiritu 2013-08-06
8493748 Packaging system with hollow package and method for the same Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jeffrey D. Punzalan 2013-07-23
8482109 Integrated circuit packaging system with dual connection and method of manufacture thereof Zigmund Ramirez Camacho, Emmanuel Espiritu 2013-07-09
8455993 Integrated circuit packaging system with multiple row leads and method of manufacture thereof Zigmund Ramirez Camacho, Emmanuel Espiritu 2013-06-04
8420508 Integrated circuit packaging system with bump contact on package leads and method of manufacture thereof Zigmund Ramirez Camacho, Emmanuel Espiritu 2013-04-16
8420447 Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof Lionel Chien Hui Tay, Zigmund Ramirez Camacho 2013-04-16
8415778 Non-leaded integrated circuit package system with multiple ground sites Jeffrey D. Punzalan, Byung Tai Do, Zigmund Ramirez Camacho 2013-04-09
8415205 Integrated circuit packaging system with lead interlocking mechanisms and method of manufacture thereof Zigmund Ramirez Camacho, Emmanuel Espiritu 2013-04-09
8409922 Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect Zigmund Ramirez Camacho, Dioscoro A. Merilo, Emmanuel Espiritu 2013-04-02
8404524 Integrated circuit packaging system with paddle molding and method of manufacture thereof Zigmund Ramirez Camacho, Emmanuel Espiritu 2013-03-26
8399991 Semiconductor device and method of forming through hole vias in die extension region around periphery of die Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Arnel Senosa Trasporto 2013-03-19
8399968 Non-leaded integrated circuit package system Jeffrey D. Punzalan, Il Kwon Shim 2013-03-19