Issued Patents All Time
Showing 76–100 of 159 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8389332 | Integrated circuit packaging system with isolated pads and method of manufacture thereof | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jose Alvin Caparas | 2013-03-05 |
| 8377750 | Integrated circuit packaging system with multiple row leads and method of manufacture thereof | Zigmund Ramirez Camacho, Dioscoro A. Merilo | 2013-02-19 |
| 8362601 | Wire-on-lead package system having leadfingers positioned between paddle extensions and method of manufacture thereof | Zigmund Ramirez Camacho, Jeffrey D. Punzalan, Lionel Chien Hui Tay | 2013-01-29 |
| 8354742 | Method and apparatus for a package having multiple stacked die | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Lionel Chien Hui Tay | 2013-01-15 |
| 8338233 | Method of manufacture of integrated circuit packaging system with stacked integrated circuit | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan | 2012-12-25 |
| 8334584 | Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu | 2012-12-18 |
| 8334171 | Package system with a shielded inverted internal stacking module and method of manufacture thereof | Reza A. Pagaila, Zigmund Ramirez Camacho | 2012-12-18 |
| 8304921 | Integrated circuit packaging system with interconnect and method of manufacture thereof | Zigmund Ramirez Camacho, Allan P. Ilagan, Philip Lyndon Cablao | 2012-11-06 |
| 8304869 | Fan-in interposer on lead frame for an integrated circuit package on package system | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Lionel Chien Hui Tay | 2012-11-06 |
| 8304337 | Integrated circuit packaging system with bond wire pads and method of manufacture thereof | Jairus Legaspi Pisigan, Zigmund Ramirez Camacho | 2012-11-06 |
| 8273602 | Integrated circuit package system with integration port | Lionel Chien Hui Tay, Zigmund Ramirez Camacho, Jose Alvin Caparas | 2012-09-25 |
| 8258609 | Integrated circuit package system with lead support | Zigmund Ramirez Camacho, Jose Alvin Caparas, Arnel Senosa Trasporto | 2012-09-04 |
| 8252666 | Semiconductor device and method of forming through hole vias in die extension region around periphery of die | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2012-08-28 |
| 8241956 | Semiconductor device and method of forming wafer level multi-row etched lead package | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Emmanuel Espiritu | 2012-08-14 |
| 8241965 | Integrated circuit packaging system with pad connection and method of manufacture thereof | Flynn Carson, Zigmund Ramirez Camacho, Emmanuel Espiritu | 2012-08-14 |
| 8236607 | Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan | 2012-08-07 |
| 8212342 | Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Lionel Chien Hui Tay | 2012-07-03 |
| 8207597 | Integrated circuit package system with flashless leads | Jeffrey D. Punzalan, Il Kwon Shim, Zigmund Ramirez Camacho | 2012-06-26 |
| 8207600 | Integrated circuit package system with encapsulating features | Jeffrey D. Punzalan, Abelardo Hadap Advincula, Jose Alvin Caparas | 2012-06-26 |
| 8203214 | Integrated circuit package in package system with adhesiveless package attach | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jeffrey D. Punzalan | 2012-06-19 |
| 8203201 | Integrated circuit packaging system with leads and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu | 2012-06-19 |
| 8193037 | Integrated circuit packaging system with pad connection and method of manufacture thereof | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Emmanuel Espiritu | 2012-06-05 |
| 8148208 | Integrated circuit package system with leaded package and method for manufacturing thereof | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Lionel Chien Hui Tay | 2012-04-03 |
| 8138595 | Integrated circuit packaging system with an intermediate pad and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu | 2012-03-20 |
| 8138586 | Integrated circuit package system with multi-planar paddle | Arnel Senosa Trasporto, Sze Min Wong, Zigmund Ramirez Camacho | 2012-03-20 |