Issued Patents All Time
Showing 126–150 of 159 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7960815 | Leadframe design for QFN package with top terminal leads | Zigmund Ramirez Camacho, Jose Alvin Caparas, Lionel Chien Hui Tay | 2011-06-14 |
| 7947534 | Integrated circuit packaging system including a non-leaded package | Jeffrey D. Punzalan, Il Kwon Shim, Keng Kiat Lau | 2011-05-24 |
| 7936053 | Integrated circuit package system with lead structures including a dummy tie bar | Jeffrey D. Punzalan, Il Kwon Shim, Zigmund Ramirez Camacho | 2011-05-03 |
| 7932130 | Method for forming an etched recess package on package system | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jairus Legaspi Pisigan | 2011-04-26 |
| 7928540 | Integrated circuit package system | Il Kwon Shim, Antonio B. Dimaano, Jr., Jeffrey D. Punzalan | 2011-04-19 |
| 7919848 | Integrated circuit package system with multiple devices | Zigmund Ramirez Camacho, Abelardo Jr Hadap Advincula, Lionel Chien Hui Tay | 2011-04-05 |
| 7911040 | Integrated circuit package with improved connections | Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2011-03-22 |
| 7901996 | Integrated circuit package system with interconnection support and method of manufacture thereof | Il Kwon Shim, Jeffrey D. Punzalan, Zigmund Ramirez Camacho | 2011-03-08 |
| 7888181 | Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jeffrey D. Punzalan | 2011-02-15 |
| 7855444 | Mountable integrated circuit package system with substrate | Zigmund Ramirez Camacho, Albelardo Jr. Hadap Advincula, Lionel Chien Hui Tay | 2010-12-21 |
| 7851246 | Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2010-12-14 |
| 7790576 | Semiconductor device and method of forming through hole vias in die extension region around periphery of die | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2010-09-07 |
| 7785929 | Mountable integrated circuit package system with exposed external interconnects | Zigmund Ramirez Camacho, Abelardo Jr. Hadap Advincula, Lionel Chien Hui Tay | 2010-08-31 |
| 7777310 | Integrated circuit package system with integral inner lead and paddle | Jeffrey D. Punzalan, Zigmund Ramirez Camacho, Arnel Senosa Trasporto | 2010-08-17 |
| 7777354 | Integrated circuit package system with leaded package | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Lionel Chien Hui Tay | 2010-08-17 |
| 7763493 | Integrated circuit package system with top and bottom terminals | Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2010-07-27 |
| 7750451 | Multi-chip package system with multiple substrates | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2010-07-06 |
| 7732901 | Integrated circuit package system with isloated leads | Zigmund Ramirez Camacho, Abelardo Hadap Advincula, Lionel Chien Hui Tay | 2010-06-08 |
| 7723840 | Integrated circuit package system with contoured die | Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2010-05-25 |
| 7714419 | Integrated circuit package system with shielding | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Guruprasad Badakere Govindaiah | 2010-05-11 |
| 7691674 | Integrated circuit packaging system with stacked device and method of manufacturing thereof | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan | 2010-04-06 |
| 7671463 | Integrated circuit package system with ground ring | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2010-03-02 |
| 7563647 | Integrated circuit package system with interconnect support | Il Kwon Shim, Jeffrey D. Punzalan, Zigmund Ramirez Camacho | 2009-07-21 |
| 7545032 | Integrated circuit package system with stiffener | Antonio B. Dimaano, Jr., Jeffrey D. Punzalan, Zigmund Ramirez Camacho | 2009-06-09 |
| 7541221 | Integrated circuit package system with leadfinger support | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2009-06-02 |