Issued Patents All Time
Showing 151–159 of 159 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7517733 | Leadframe design for QFN package with top terminal leads | Zigmund Ramirez Camacho, Jose Alvin Caparas, Lionel Chien Hui Tay | 2009-04-14 |
| 7498665 | Integrated circuit leadless package system | Leocadio Morona Alabin, Il Kwon Shim, Jeffrey D. Punzalan | 2009-03-03 |
| 7479692 | Integrated circuit package system with heat sink | Antonio B. Dimaano, Jr., Il Kwon Shim, Jeffrey D. Punzalan | 2009-01-20 |
| 7479409 | Integrated circuit package with elevated edge leadframe | Zigmund Ramirez Camacho, Jose Alvin Caparas, Jeffrey D. Punzalan | 2009-01-20 |
| 7420265 | Integrated circuit package system with integrated circuit support | Il Kwon Shim, Jeffrey D. Punzalan, Zigmund Ramirez Camacho | 2008-09-02 |
| 7400049 | Integrated circuit package system with heat sink | Il Kwon Shim, Zigmund Ramirez Camacho, Jeffrey D. Punzalan | 2008-07-15 |
| 7365417 | Overhang integrated circuit package system | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2008-04-29 |
| 7274089 | Integrated circuit package system with adhesive restraint | Jeffrey D. Punzalan, Il Kwon Shim, Zigmund Ramirez Camacho | 2007-09-25 |
| 6833287 | System for semiconductor package with stacked dies | Hyeong Hur, Zigmund Ramirez Camacho | 2004-12-21 |