HB

Henry Descalzo Bathan

SC Stats Chippac: 153 patents #6 of 425Top 2%
SE Semtech: 5 patents #20 of 201Top 10%
SS St Assembly Test Services: 1 patents #36 of 63Top 60%
📍 Thousand Oaks, CA: #2 of 1,766 inventorsTop 1%
🗺 California: #886 of 386,348 inventorsTop 1%
Overall (All Time): #5,464 of 4,157,543Top 1%
159
Patents All Time

Issued Patents All Time

Showing 101–125 of 159 patents

Patent #TitleCo-InventorsDate
8138027 Optical semiconductor device having pre-molded leadframe with window and method therefor Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Arnel Senosa Trasporto 2012-03-20
8120150 Integrated circuit package system with dual connectivity Guruprasad Badakere Govindaiah, Zigmund Ramirez Camacho, Jeffrey D. Punzalan, Lionel Chien Hui Tay 2012-02-21
8120156 Integrated circuit package system with die on base package Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jeffrey D. Punzalan 2012-02-21
8120149 Integrated circuit package system Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jeffrey D. Punzalan 2012-02-21
8115305 Integrated circuit package system with thin profile Zigmund Ramirez Camacho, Abelardo Hadap Advincula, Lionel Chien Hui Tay 2012-02-14
8110440 Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure Zigmund Ramirez Camacho, Jairus Legaspi Pisigan 2012-02-07
8106502 Integrated circuit packaging system with plated pad and method of manufacture thereof Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Lionel Chien Hui Tay 2012-01-31
8106499 Integrated circuit packaging system with a dual substrate package and method of manufacture thereof Zigmund Ramirez Camacho, Jairus Legaspi Pisigan 2012-01-31
8080867 Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof Zigmund Ramirez Camacho, Jairus Legaspi Pisigan 2011-12-20
8076184 Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die Zigmund Ramirez Camacho, Emmanuel Espiritu, Dioscoro A. Merilo 2011-12-13
8072047 Integrated circuit package system with shield and tie bar Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Guruprasad Badakere Govindaiah 2011-12-06
8067825 Integrated circuit package system with multiple die Abelardo Jr. Hadap Advincula, Zigmund Ramirez Camacho, Jairus Legaspi Pisigan 2011-11-29
8062934 Integrated circuit package system with ground bonds Jeffrey D. Punzalan, Zigmund Ramirez Camacho 2011-11-22
8043894 Integrated circuit package system with redistribution layer Lionel Chien Hui Tay, Zigmund Ramirez Camacho 2011-10-25
8039947 Integrated circuit package system with different mold locking features Jeffrey D. Punzalan, Zigmund Ramirez Camacho 2011-10-18
8039302 Semiconductor package and method of forming similar structure for top and bottom bonding pads Lionel Chien Hui Tay, Zigmund Ramirez Camacho 2011-10-18
8035207 Stackable integrated circuit package system with recess Zigmund Ramirez Camacho, Jose Alvin Caparas, Lionel Chien Hui Tay 2011-10-11
8022539 Integrated circuit packaging system with increased connectivity and method of manufacture thereof Frederick R. Dahilig, Zigmund Ramirez Camacho, Lionel Chien Hui Tay 2011-09-20
8022514 Integrated circuit package system with leadfinger support Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jeffrey D. Punzalan 2011-09-20
8003443 Non-leaded integrated circuit package system with multiple ground sites Jeffrey D. Punzalan, Byung Tai Do, Zigmund Ramirez Camacho 2011-08-23
7998790 Integrated circuit packaging system with isolated pads and method of manufacture thereof Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jose Alvin Caparas 2011-08-16
7993939 Integrated circuit package system with laminate base Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jeffrey D. Punzalan 2011-08-09
7977779 Mountable integrated circuit package-in-package system Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Lionel Chien Hui Tay 2011-07-12
7977778 Integrated circuit package system with interference-fit feature Lionel Chien Hui Tay, Zigmund Ramirez Camacho 2011-07-12
7977579 Multiple flip-chip integrated circuit package system Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jeffrey D. Punzalan 2011-07-12