Issued Patents All Time
Showing 51–62 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7911067 | Semiconductor package system with die support pad | Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2011-03-22 |
| 7868434 | Integrated circuit package-on-package stacking system | Heap Hoe Kuan, You Yang Ong, Seng Guan Chow, Ma. Shirley Asoy | 2011-01-11 |
| 7859098 | Embedded integrated circuit package system | You Yang Ong, Seng Guan Chow | 2010-12-28 |
| 7830020 | Integrated circuit package system employing device stacking | Frederick R. Dahilig, Sheila Marie L. Alvarez, Antonio B. Dimaano, Jr. | 2010-11-09 |
| 7777320 | Quad flat pack in quad flat pack integrated circuit package system | Antonio B. Dimaano, Jr. | 2010-08-17 |
| 7741707 | Stackable integrated circuit package system | Seng Guan Chow, Heap Hoe Kuan, Antonio B. Dimaano, Jr. | 2010-06-22 |
| 7718472 | Integrated circuit package-on-package stacking system and method of manufacture thereof | Heap Hoe Kuan, You Yang Ong, Seng Guan Chow, Ma. Shirley Asoy | 2010-05-18 |
| 7709944 | Integrated circuit package system with package integration | Heap Hoe Kuan, Seng Guan Chow, Linda Pei Ee Chua | 2010-05-04 |
| 7535086 | Integrated circuit package-on-package stacking system | Heap Hoe Kuan, You Yang Ong, Seng Guan Chow, Ma. Shirley Asoy | 2009-05-19 |
| 7385299 | Stackable integrated circuit package system with multiple interconnect interface | Seng Guan Chow, Heap Hoe Kuan, Antonio B. Dimaano, Jr. | 2008-06-10 |
| 6744125 | Super thin/super thermal ball grid array package | Raymundo M. Camenforte, Seng Guan Chow | 2004-06-01 |
| 6537848 | Super thin/super thermal ball grid array package | Raymundo M. Camenforte, Seng Guan Chow | 2003-03-25 |