Issued Patents All Time
Showing 26–50 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8729693 | Integrated circuit packaging system with a leaded package and method of manufacture thereof | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Henry Descalzo Bathan | 2014-05-20 |
| 8722457 | System and apparatus for wafer level integration of components | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Henry Descalzo Bathan | 2014-05-13 |
| 8692377 | Integrated circuit packaging system with plated leads and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2014-04-08 |
| 8664038 | Integrated circuit packaging system with stacked paddle and method of manufacture thereof | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jose Alvin Caparas | 2014-03-04 |
| 8643157 | Integrated circuit package system having perimeter paddle | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan | 2014-02-04 |
| 8592252 | Semiconductor device and method of forming through hole vias in die extension region around periphery of die | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Arnel Senosa Trasporto | 2013-11-26 |
| 8586422 | Optical semiconductor device having pre-molded leadframe with window and method therefor | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Amel Senosa Trasporto | 2013-11-19 |
| 8546189 | Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jeffrey D. Punzalan, Dioscoro A. Merilo | 2013-10-01 |
| 8536690 | Integrated circuit packaging system with cap layer and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Guruprasad Badakere Govindaiah | 2013-09-17 |
| 8518749 | Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die | Frederick R. Dahilig, Zigmund Ramirez Camacho, Dioscoro A. Merilo | 2013-08-27 |
| 8513801 | Integrated circuit package system | Jairus Legaspi Pisigan, Zigmund Ramirez Camacho | 2013-08-20 |
| 8502376 | Wirebondless wafer level package with plated bumps and interconnects | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Jose Alvin Caparas | 2013-08-06 |
| 8502371 | Integrated circuit package system with extended corner leads | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Henry Descalzo Bathan | 2013-08-06 |
| 8493748 | Packaging system with hollow package and method for the same | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2013-07-23 |
| 8421198 | Integrated circuit package system with external interconnects at high density | Zigmund Ramirez Camacho, Abelardo Hadap Advincula | 2013-04-16 |
| 8420447 | Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof | Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2013-04-16 |
| 8399991 | Semiconductor device and method of forming through hole vias in die extension region around periphery of die | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Arnel Senosa Trasporto | 2013-03-19 |
| 8389332 | Integrated circuit packaging system with isolated pads and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jose Alvin Caparas | 2013-03-05 |
| 8362601 | Wire-on-lead package system having leadfingers positioned between paddle extensions and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2013-01-29 |
| 8354742 | Method and apparatus for a package having multiple stacked die | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Henry Descalzo Bathan | 2013-01-15 |
| 8344495 | Integrated circuit packaging system with interconnect and method of manufacture thereof | Zigmund Ramirez Camacho, Philip Lyndon Cablao, Frederick R. Dahilig | 2013-01-01 |
| 8304869 | Fan-in interposer on lead frame for an integrated circuit package on package system | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Henry Descalzo Bathan | 2012-11-06 |
| 8283209 | Semiconductor device and method of forming PiP with inner known good die interconnected with conductive bumps | Zigmund Ramirez Camacho, Frederick R. Dahilig | 2012-10-09 |
| 8283250 | Semiconductor device and method of forming a conductive via-in-via structure | Jianmin Fang, Zigmund Ramirez Camacho | 2012-10-09 |
| 8278148 | Integrated circuit package system with leads separated from a die paddle | Jeffrey D. Punzalan, Jairus Legaspi Pisigan, Zigmund Ramirez Camacho | 2012-10-02 |