LT

Lionel Chien Hui Tay

SC Stats Chippac: 109 patents #10 of 425Top 3%
JC Jcet Semiconductor (Shaoxing) Co.: 1 patents #18 of 38Top 50%
📍 Singapore, SG: #21 of 13,971 inventorsTop 1%
Overall (All Time): #12,013 of 4,157,543Top 1%
110
Patents All Time

Issued Patents All Time

Showing 76–100 of 110 patents

Patent #TitleCo-InventorsDate
8035207 Stackable integrated circuit package system with recess Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jose Alvin Caparas 2011-10-11
8022539 Integrated circuit packaging system with increased connectivity and method of manufacture thereof Frederick R. Dahilig, Zigmund Ramirez Camacho, Henry Descalzo Bathan 2011-09-20
7998790 Integrated circuit packaging system with isolated pads and method of manufacture thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jose Alvin Caparas 2011-08-16
7977778 Integrated circuit package system with interference-fit feature Henry Descalzo Bathan, Zigmund Ramirez Camacho 2011-07-12
7977780 Multi-layer package-on-package system Jairus Legaspi Pisigan, Zigmund Ramirez Camacho 2011-07-12
7977782 Integrated circuit package system with dual connectivity Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Jose Alvin Caparas 2011-07-12
7977779 Mountable integrated circuit package-in-package system Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Henry Descalzo Bathan 2011-07-12
7964450 Wirebondless wafer level package with plated bumps and interconnects Zigmund Ramirez Camacho, Dioscoro A. Merilo, Jose Alvin Caparas 2011-06-21
7960815 Leadframe design for QFN package with top terminal leads Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jose Alvin Caparas 2011-06-14
7932130 Method for forming an etched recess package on package system Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jairus Legaspi Pisigan 2011-04-26
7919848 Integrated circuit package system with multiple devices Zigmund Ramirez Camacho, Henry Descalzo Bathan, Abelardo Jr Hadap Advincula 2011-04-05
7919850 Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof Arnel Senosa Trasporto, Zigmund Ramirez Camacho, Abelardo Hadap Advincula 2011-04-05
7915724 Integrated circuit packaging system with base structure device Jong-Woo Ha, Koo Hong Lee, Soo Won Lee, Juhyun Park, Zigmund Ramirez Camacho +2 more 2011-03-29
7915716 Integrated circuit package system with leadframe array Jairus Legaspi Pisigan, Jeffrey D. Punzalan, Zigmund Ramirez Camacho 2011-03-29
7911067 Semiconductor package system with die support pad Zigmund Ramirez Camacho, Dioscoro A. Merilo 2011-03-22
7911040 Integrated circuit package with improved connections Henry Descalzo Bathan, Zigmund Ramirez Camacho 2011-03-22
7888181 Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jeffrey D. Punzalan 2011-02-15
7871862 Ball grid array package stacking system Seng Guan Chow 2011-01-18
7863732 Ball grid array package system Seng Guan Chow 2011-01-04
7863102 Integrated circuit package system with external interconnects within a die platform Seng Guan Chow 2011-01-04
7855444 Mountable integrated circuit package system with substrate Zigmund Ramirez Camacho, Albelardo Jr. Hadap Advincula, Henry Descalzo Bathan 2010-12-21
7851246 Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device Zigmund Ramirez Camacho, Henry Descalzo Bathan, Arnel Senosa Trasporto 2010-12-14
7842607 Semiconductor device and method of providing a thermal dissipation path through RDL and conductive via Guruprasad G. Badakere, Zigmund Ramirez Camacho 2010-11-30
7838395 Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the same Guruprasad G. Badakere, Zigmund Ramirez Camacho 2010-11-23
7790576 Semiconductor device and method of forming through hole vias in die extension region around periphery of die Henry Descalzo Bathan, Zigmund Ramirez Camacho, Arnel Senosa Trasporto 2010-09-07