Issued Patents All Time
Showing 51–75 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8273602 | Integrated circuit package system with integration port | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Jose Alvin Caparas | 2012-09-25 |
| 8269324 | Integrated circuit package system with chip on lead | Arnel Senosa Trasporto, Zigmund Ramirez Camacho, Jose Alvin Caparas | 2012-09-18 |
| 8258614 | Integrated circuit package system with package integration | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Abelardo Jr. Hadap Advincula | 2012-09-04 |
| 8252666 | Semiconductor device and method of forming through hole vias in die extension region around periphery of die | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Arnel Senosa Trasporto | 2012-08-28 |
| 8252634 | Integrated circuit packaging system with a leadframe having radial-segments and method of manufacture thereof | Zigmund Ramirez Camacho, Jose Alvin Caparas | 2012-08-28 |
| 8241954 | Wafer level die integration and method | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Frederick R. Dahilig | 2012-08-14 |
| 8216883 | Method for manufacturing semiconductor package system with die support pad | Zigmund Ramirez Camacho, Dioscoro A. Merilo | 2012-07-10 |
| 8212342 | Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Henry Descalzo Bathan | 2012-07-03 |
| 8203214 | Integrated circuit package in package system with adhesiveless package attach | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Jeffrey D. Punzalan | 2012-06-19 |
| 8203220 | Integrated circuit package system with multiple device units and method for manufacturing thereof | Zigmund Ramirez Camacho, Jeffrey D. Punzalan, Arnel Senosa Trasporto | 2012-06-19 |
| 8174098 | Semiconductor device and method of providing a thermal dissipation path through RDL and conductive via | Govindiah G. Badakere, Zigmund Ramirez Camacho | 2012-05-08 |
| 8148208 | Integrated circuit package system with leaded package and method for manufacturing thereof | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Henry Descalzo Bathan | 2012-04-03 |
| 8148825 | Integrated circuit package system with leadfinger | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Jeffrey D. Punzalan | 2012-04-03 |
| 8138027 | Optical semiconductor device having pre-molded leadframe with window and method therefor | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Arnel Senosa Trasporto | 2012-03-20 |
| 8134227 | Stacked integrated circuit package system with conductive spacer | Rui Huang, Seng Guan Chow | 2012-03-13 |
| 8134242 | Integrated circuit package system with concave terminal | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Reza A. Pagaila | 2012-03-13 |
| 8120150 | Integrated circuit package system with dual connectivity | Guruprasad Badakere Govindaiah, Zigmund Ramirez Camacho, Jeffrey D. Punzalan, Henry Descalzo Bathan | 2012-02-21 |
| 8115305 | Integrated circuit package system with thin profile | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Abelardo Hadap Advincula | 2012-02-14 |
| 8115287 | Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof | Zigmund Ramirez Camacho, Abelardo Jr. Hadap Advincula, Erwin Aguas Sangalang | 2012-02-14 |
| 8106502 | Integrated circuit packaging system with plated pad and method of manufacture thereof | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Jairus Legaspi Pisigan | 2012-01-31 |
| 8097943 | Semiconductor device and method of forming wafer level ground plane and power ring | Guruprasad G. Badakere, Zigmund Ramirez Camacho | 2012-01-17 |
| 8072047 | Integrated circuit package system with shield and tie bar | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Guruprasad Badakere Govindaiah | 2011-12-06 |
| 8072079 | Through hole vias at saw streets including protrusions or recesses for interconnection | Reza A. Pagaila, Zigmund Ramirez Camacho, Byung Tai Do | 2011-12-06 |
| 8043894 | Integrated circuit package system with redistribution layer | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2011-10-25 |
| 8039302 | Semiconductor package and method of forming similar structure for top and bottom bonding pads | Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2011-10-18 |