LT

Lionel Chien Hui Tay

SC Stats Chippac: 109 patents #10 of 425Top 3%
JC Jcet Semiconductor (Shaoxing) Co.: 1 patents #18 of 38Top 50%
📍 Singapore, SG: #21 of 13,971 inventorsTop 1%
Overall (All Time): #12,013 of 4,157,543Top 1%
110
Patents All Time

Issued Patents All Time

Showing 101–110 of 110 patents

Patent #TitleCo-InventorsDate
7785929 Mountable integrated circuit package system with exposed external interconnects Zigmund Ramirez Camacho, Abelardo Jr. Hadap Advincula, Henry Descalzo Bathan 2010-08-31
7777354 Integrated circuit package system with leaded package Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Henry Descalzo Bathan 2010-08-17
7763493 Integrated circuit package system with top and bottom terminals Henry Descalzo Bathan, Zigmund Ramirez Camacho 2010-07-27
7759806 Integrated circuit package system with multiple device units Zigmund Ramirez Camacho, Jeffrey D. Punzalan, Arnel Senosa Trasporto 2010-07-20
7750451 Multi-chip package system with multiple substrates Zigmund Ramirez Camacho, Henry Descalzo Bathan, Arnel Senosa Trasporto 2010-07-06
7732901 Integrated circuit package system with isloated leads Zigmund Ramirez Camacho, Henry Descalzo Bathan, Abelardo Hadap Advincula 2010-06-08
7723840 Integrated circuit package system with contoured die Henry Descalzo Bathan, Zigmund Ramirez Camacho 2010-05-25
7714419 Integrated circuit package system with shielding Zigmund Ramirez Camacho, Henry Descalzo Bathan, Guruprasad Badakere Govindaiah 2010-05-11
7582957 Integrated circuit package system with encapsulation lock 2009-09-01
7517733 Leadframe design for QFN package with top terminal leads Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jose Alvin Caparas 2009-04-14