Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermal enhanced package using embedded substrate

Thermal enhanced package using embedded substrate

US Patent 9564391 · Granted Feb 7, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method for assessing a digital interaction with a digital third party2024
System and method for detection of defects in semiconductor devices2023
Redistribution metal and under bump metal interconnect structures and method2021
Thin recon interposer package without TSV for fine input/output pitch fan-out2020
Redistribution metal and under bump metal interconnect structures and method2019
Thin recon interposer package without TSV for fine input/output pitch fan-out2018
Magnetic-core three-dimensional (3D) inductors and packaging integration2017
Semiconductor border protection sealant2016
Wafer level package resistance monitor scheme2015
Fabricating a wafer level semiconductor package having a pre-formed dielectric l2015
Fabricating a wafer level semiconductor package having a pre-formed dielectric l2015
Wafer level semiconductor package2014