Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12026704 | System and method for assessing a digital interaction with a digital third party account service | Eric Morse, Max L. Johnson, Austin Lin Gibbons, Samir Naik | 2024-07-02 |
| 11830828 | System and method for detection of defects in semiconductor devices | Liang Li, Wendy Yu | 2023-11-28 |
| 9564391 | Thermal enhanced package using embedded substrate | Edward Law | 2017-02-07 |
| 8945991 | Fabricating a wafer level semiconductor package having a pre-formed dielectric layer | Chonghua Zhong, Edward Law | 2015-02-03 |
| 8922014 | Wafer level semiconductor package | Chonghua Zhong, Edward Law | 2014-12-30 |
| 8592259 | Method of fabricating a wafer level semiconductor package having a pre-formed dielectric layer | Chonghua Zhong, Edward Law | 2013-11-26 |
| 8587123 | Multi-chip and multi-substrate reconstitution based packaging | Edward Law, Rezaur Rahman Khan | 2013-11-19 |
| 7301235 | Semiconductor device module with flip chip devices on a common lead frame | Christopher P. Schaffer, Chuan Cheah | 2007-11-27 |