Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8860543 | Wire-less inductive devices and methods | Aurelio J. Gutierrez | 2014-10-14 |
| 8845367 | Modular electronic header assembly and methods of manufacture | Aurelio J. Gutierrez, Russell L. Machado, Victor H. Renteria | 2014-09-30 |
| 8754734 | Simplified inductive devices and methods | Aurelio J. Gutierrez | 2014-06-17 |
| 8591262 | Substrate inductive devices and methods | Aurelio J. Gutierrez | 2013-11-26 |
| 8234778 | Substrate inductive devices and methods | Alan Lindner | 2012-08-07 |
| 8118619 | Power-enabled connector assembly and method of manufacturing | Thomas Rascon | 2012-02-21 |
| 7982572 | Substrate inductive devices and methods | Aurelio J. Gutierrez, Alan Lindner | 2011-07-19 |
| 7942700 | Modular electronic header assembly and methods of manufacture | Aurelio J. Gutierrez, Russell L. Machado, Victor H. Renteria | 2011-05-17 |
| 7845984 | Power-enabled connector assembly and method of manufacturing | Thomas Rascon | 2010-12-07 |
| 7745257 | High power MCM package with improved planarity and heat dissipation | — | 2010-06-29 |
| 7708602 | Connector keep-out apparatus and methods | Thomas Rascon, Gary L. Hurd | 2010-05-04 |
| 7453146 | High power MCM package with improved planarity and heat dissipation | — | 2008-11-18 |
| 7355431 | Test arrangement including anisotropic conductive film for testing power module | Johan Tjeerd Strydom, Andrea Ciuffoli | 2008-04-08 |
| 7301235 | Semiconductor device module with flip chip devices on a common lead frame | Chuan Cheah, Kevin Hu | 2007-11-27 |
| 6946740 | High power MCM package | — | 2005-09-20 |
| 6534792 | Microelectronic device structure with metallic interlayer between substrate and die | — | 2003-03-18 |
| 6489634 | Microelectronic device structure utilizing a diamond inlay in a package flange | Steven R. Burkhart, Bartley J. Price | 2002-12-03 |