| 8860543 |
Wire-less inductive devices and methods |
Aurelio J. Gutierrez |
2014-10-14 |
| 8845367 |
Modular electronic header assembly and methods of manufacture |
Aurelio J. Gutierrez, Russell L. Machado, Victor H. Renteria |
2014-09-30 |
| 8754734 |
Simplified inductive devices and methods |
Aurelio J. Gutierrez |
2014-06-17 |
| 8591262 |
Substrate inductive devices and methods |
Aurelio J. Gutierrez |
2013-11-26 |
| 8234778 |
Substrate inductive devices and methods |
Alan Lindner |
2012-08-07 |
| 8118619 |
Power-enabled connector assembly and method of manufacturing |
Thomas Rascon |
2012-02-21 |
| 7982572 |
Substrate inductive devices and methods |
Aurelio J. Gutierrez, Alan Lindner |
2011-07-19 |
| 7942700 |
Modular electronic header assembly and methods of manufacture |
Aurelio J. Gutierrez, Russell L. Machado, Victor H. Renteria |
2011-05-17 |
| 7845984 |
Power-enabled connector assembly and method of manufacturing |
Thomas Rascon |
2010-12-07 |
| 7745257 |
High power MCM package with improved planarity and heat dissipation |
— |
2010-06-29 |
| 7708602 |
Connector keep-out apparatus and methods |
Thomas Rascon, Gary L. Hurd |
2010-05-04 |
| 7453146 |
High power MCM package with improved planarity and heat dissipation |
— |
2008-11-18 |
| 7355431 |
Test arrangement including anisotropic conductive film for testing power module |
Johan Tjeerd Strydom, Andrea Ciuffoli |
2008-04-08 |
| 7301235 |
Semiconductor device module with flip chip devices on a common lead frame |
Chuan Cheah, Kevin Hu |
2007-11-27 |
| 6946740 |
High power MCM package |
— |
2005-09-20 |
| 6534792 |
Microelectronic device structure with metallic interlayer between substrate and die |
— |
2003-03-18 |
| 6489634 |
Microelectronic device structure utilizing a diamond inlay in a package flange |
Steven R. Burkhart, Bartley J. Price |
2002-12-03 |