Christopher P. Schaffer — 17 Patents at Pulse Electronics

Christopher P. Schaffer has been granted 17 US patents while listed as an inventor at Pulse Electronics. The first was granted in 2002 and the most recent in October 2014. Christopher P. Schaffer ranks #263,971 of 4,157,543 US inventors in our database (top 6.3%). Patent records list Christopher P. Schaffer in Long Beach, CA, US.

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8860543	Wire-less inductive devices and methods	Aurelio J. Gutierrez	2014-10-14	$440,000
8845367	Modular electronic header assembly and methods of manufacture	Aurelio J. Gutierrez, Russell L. Machado, Victor H. Renteria	2014-09-30	$496,000
8754734	Simplified inductive devices and methods	Aurelio J. Gutierrez	2014-06-17	$804,000
8591262	Substrate inductive devices and methods	Aurelio J. Gutierrez	2013-11-26	$608,000
8234778	Substrate inductive devices and methods	Alan Lindner	2012-08-07	$977,000
8118619	Power-enabled connector assembly and method of manufacturing	Thomas Rascon	2012-02-21	$1,709,000
7982572	Substrate inductive devices and methods	Aurelio J. Gutierrez, Alan Lindner	2011-07-19
7942700	Modular electronic header assembly and methods of manufacture	Aurelio J. Gutierrez, Russell L. Machado, Victor H. Renteria	2011-05-17
7845984	Power-enabled connector assembly and method of manufacturing	Thomas Rascon	2010-12-07
7745257	High power MCM package with improved planarity and heat dissipation	—	2010-06-29	$2,736,000
7708602	Connector keep-out apparatus and methods	Thomas Rascon, Gary L. Hurd	2010-05-04
7453146	High power MCM package with improved planarity and heat dissipation	—	2008-11-18	$4,181,000
7355431	Test arrangement including anisotropic conductive film for testing power module	Johan Tjeerd Strydom, Andrea Ciuffoli	2008-04-08	$3,987,000
7301235	Semiconductor device module with flip chip devices on a common lead frame	Chuan Cheah, Kevin Hu	2007-11-27	$3,074,000
6946740	High power MCM package	—	2005-09-20	$20,967,000
6534792	Microelectronic device structure with metallic interlayer between substrate and die	—	2003-03-18	$83,058,000
6489634	Microelectronic device structure utilizing a diamond inlay in a package flange	Steven R. Burkhart, Bartley J. Price	2002-12-03	$29,583,000

Christopher P. Schaffer — 17 Patents

Issued Patents All Time

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