Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9013035 | Thermal improvement for hotspots on dies in integrated circuit packages | Sam Ziqun Zhao | 2015-04-21 |
| 9013041 | Semiconductor package with ultra-thin interposer without through-semiconductor vias | Sampath K. V. Karikalan, Sam Ziqun Zhao, Kevin Kunzhong Hu, Pieter Vorenkamp, Xiangdong Chen | 2015-04-21 |
| 8928128 | Semiconductor package with integrated electromagnetic shielding | Sampath K. V. Karikalan, Kevin Kunzhong Hu, Sam Ziqun Zhao, Pieter Vorenkamp, Xiangdong Chen | 2015-01-06 |
| 8872321 | Semiconductor packages with integrated heat spreaders | Sam Ziqun Zhao, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Pieter Vorenkamp, Xiangdong Chen | 2014-10-28 |
| 8829654 | Semiconductor package with interposer | Sam Ziqun Zhao | 2014-09-09 |
| 8829656 | Semiconductor package including interposer with through-semiconductor vias | Sam Ziqun Zhao | 2014-09-09 |
| 8829655 | Semiconductor package including a substrate and an interposer | Sam Ziqun Zhao | 2014-09-09 |
| 8823144 | Semiconductor package with interface substrate having interposer | Sam Ziqun Zhao | 2014-09-02 |
| 8791533 | Semiconductor package having an interposer configured for magnetic signaling | Xiangdong Chen, Sam Ziqun Zhao, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Pieter Vorenkamp | 2014-07-29 |
| 8749072 | Semiconductor package with integrated selectively conductive film interposer | Sam Ziqun Zhao, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Pieter Vorenkamp, Xiangdong Chen | 2014-06-10 |
| 8718550 | Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding | Sam Ziqun Zhao | 2014-05-06 |
| 8664772 | Interface substrate with interposer | Sam Ziqun Zhao | 2014-03-04 |
| 8587132 | Semiconductor package including an organic substrate and interposer having through-semiconductor vias | Sam Ziqun Zhao | 2013-11-19 |
| 8587123 | Multi-chip and multi-substrate reconstitution based packaging | Edward Law, Kevin Hu | 2013-11-19 |
| 8581381 | Integrated circuit (IC) package stacking and IC packages formed by same | Sam Ziqun Zhao | 2013-11-12 |
| 8558395 | Organic interface substrate having interposer with through-semiconductor vias | Sam Ziqun Zhao | 2013-10-15 |
| 8508045 | Package 3D interconnection and method of making same | Sam Ziqun Zhao | 2013-08-13 |
| 8417200 | Wideband power efficient high transmission power radio frequency (RF) transmitter | Ray (Ramon) Gomez, Leonard Dauphinee, Massimo Brandolini, Jianhong Xiao, Dongsoo Daniel Koh +2 more | 2013-04-09 |
| 8367475 | Chip scale package assembly in reconstitution panel process format | Edward Law, Edmund Law | 2013-02-05 |
| 8269323 | Integrated circuit package with etched leadframe for package-on-package interconnects | Ken Jian Ming Wang | 2012-09-18 |
| 8212149 | Mutual capacitance and magnetic field distribution control for transmission lines | Sampath Komarapalayam Velayudham Karikalan | 2012-07-03 |
| 8183680 | No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement | Sam Ziqun Zhao | 2012-05-22 |
| 8183687 | Interposer for die stacking in semiconductor packages and the method of making the same | Sam Ziqun Zhao | 2012-05-22 |
| 8169067 | Low profile ball grid array (BGA) package with exposed die and method of making same | Edward Law, Sam Ziqun Zhao | 2012-05-01 |
| 8102027 | IC package sacrificial structures for crack propagation confinement | Sam Ziqun Zhao, Chonghua Zhong | 2012-01-24 |