Issued Patents All Time
Showing 51–59 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039949 | Ball grid array package having one or more stiffeners | Sam Ziqun Zhao, Edward Law, Marc Papageorge | 2011-10-18 |
| 7872335 | Lead frame-BGA package with enhanced thermal performance and I/O counts | Ken Jian Ming Wang | 2011-01-18 |
| 7808087 | Leadframe IC packages having top and bottom integrated heat spreaders | Sam Ziqun Zhao | 2010-10-05 |
| 7714453 | Interconnect structure and formation for package stacking of molded plastic area array package | Sam Ziqun Zhao | 2010-05-11 |
| 7618849 | Integrated circuit package with etched leadframe for package-on-package interconnects | Ken Jian Ming Wang | 2009-11-17 |
| 7579217 | Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader | Sam Ziqun Zhao | 2009-08-25 |
| 7566590 | Low voltage drop and high thermal performance ball grid array package | Chong Zhong | 2009-07-28 |
| 7462933 | Ball grid array package enhanced with a thermal and electrical connector | Sam Ziqun Zhao | 2008-12-09 |
| 7202559 | Method of assembling a ball grid array package with patterned stiffener layer | Sam Ziqun Zhao | 2007-04-10 |