| 9548251 |
Semiconductor interposer having a cavity for intra-interposer die |
Rezaur Rahman Khan, Sam Ziqun Zhao, Pieter Vorenkamp, Kevin Kunzhong Hu, Xiangdong Chen |
2017-01-17 |
| 9431371 |
Semiconductor package with a bridge interposer |
Sam Ziqun Zhao, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen |
2016-08-30 |
| 9349697 |
Microbump and sacrificial pad pattern |
Lynn Ooi |
2016-05-24 |
| 9293393 |
Stacked packaging using reconstituted wafers |
Kevin Kunzhong Hu, Sam Ziqun Zhao, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen |
2016-03-22 |
| 9275976 |
System-in-package with integrated socket |
Sam Ziqun Zhao, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen |
2016-03-01 |
| 9153507 |
Semiconductor package with improved testability |
Sam Ziqun Zhao, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen |
2015-10-06 |
| 9059179 |
Semiconductor package with a bridge interposer |
Sam Ziqun Zhao, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen |
2015-06-16 |
| 9041171 |
Programmable interposer with conductive particles |
Sam Ziqun Zhao, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen |
2015-05-26 |
| 9013041 |
Semiconductor package with ultra-thin interposer without through-semiconductor vias |
Sam Ziqun Zhao, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen |
2015-04-21 |
| 8928128 |
Semiconductor package with integrated electromagnetic shielding |
Kevin Kunzhong Hu, Sam Ziqun Zhao, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen |
2015-01-06 |
| 8907488 |
Microbump and sacrificial pad pattern |
Lynn Ooi |
2014-12-09 |
| 8872321 |
Semiconductor packages with integrated heat spreaders |
Sam Ziqun Zhao, Rezaur Rahman Khan, Kevin Kunzhong Hu, Pieter Vorenkamp, Xiangdong Chen |
2014-10-28 |
| 8791533 |
Semiconductor package having an interposer configured for magnetic signaling |
Xiangdong Chen, Sam Ziqun Zhao, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp |
2014-07-29 |
| 8749072 |
Semiconductor package with integrated selectively conductive film interposer |
Sam Ziqun Zhao, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen |
2014-06-10 |
