Patents per Year
Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9287189 | Flexible routing for chip on board applications | Milind S. Bhagavat, Javed Iqbal Sandhu, Rezaur Rahman Khan | 2016-03-15 | |
| 8643164 | Package-on-package technology for fan-out wafer-level packaging | Matthew Kaufmann | 2014-02-04 | $3,722,000 |
| 7834449 | Highly reliable low cost structure for wafer-level ball grid array packaging | Matthew Kaufmann | 2010-11-16 | $4,615,000 |