Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9287189 | Flexible routing for chip on board applications | Milind S. Bhagavat, Javed Iqbal Sandhu, Rezaur Rahman Khan | 2016-03-15 |
| 8643164 | Package-on-package technology for fan-out wafer-level packaging | Matthew Kaufmann | 2014-02-04 |
| 7834449 | Highly reliable low cost structure for wafer-level ball grid array packaging | Matthew Kaufmann | 2010-11-16 |