Matthew Kaufmann — 11 Patents at Broadcom

Matthew Kaufmann has been granted 11 US patents while listed as an inventor at Broadcom. The first was granted in 2008 and the most recent in August 2018. Matthew Kaufmann ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Matthew Kaufmann in معلمی نژاد, CA, US.

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10043924	Low cost optical sensor package	—	2018-08-07	$97,988,000
8957516	Low cost and high performance flip chip package	Mengzhi Pang, Ken Zhonghua Wu	2015-02-17	$5,270,000
8890298	Embedded package security tamper mesh	Mark Buer	2014-11-18	$6,114,000
8749011	System and method for reducing voltage drops in integrated circuits	Morteza Cyrus Afghahi	2014-06-10	$3,190,000
8643164	Package-on-package technology for fan-out wafer-level packaging	Teck Yang Tan	2014-02-04	$3,722,000
8508054	Enhanced bump pitch scaling	Mengzhi Pang	2013-08-13	$3,648,000
8502396	Embedded package security tamper mesh	Mark Buer	2013-08-06	$2,790,000
8269321	Low cost lead frame package and method for forming same	Ken Jian Ming Wang	2012-09-18	$4,160,000
7872347	Larger than die size wafer-level redistribution packaging process	—	2011-01-18	$6,703,000
7834449	Highly reliable low cost structure for wafer-level ball grid array packaging	Teck Yang Tan	2010-11-16	$4,615,000
7449365	Wafer-level flipchip package with IC circuit isolation	Arya Behzad, Malcolm MacIntosh, Jacob Rael, Henry Chen	2008-11-11	$3,508,000

Matthew Kaufmann — 11 Patents

Issued Patents All Time

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