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Low cost optical sensor package |
— |
2018-08-07 |
| 8957516 |
Low cost and high performance flip chip package |
Mengzhi Pang, Ken Zhonghua Wu |
2015-02-17 |
| 8890298 |
Embedded package security tamper mesh |
Mark Buer |
2014-11-18 |
| 8749011 |
System and method for reducing voltage drops in integrated circuits |
Morteza Cyrus Afghahi |
2014-06-10 |
| 8643164 |
Package-on-package technology for fan-out wafer-level packaging |
Teck Yang Tan |
2014-02-04 |
| 8508054 |
Enhanced bump pitch scaling |
Mengzhi Pang |
2013-08-13 |
| 8502396 |
Embedded package security tamper mesh |
Mark Buer |
2013-08-06 |
| 8269321 |
Low cost lead frame package and method for forming same |
Ken Jian Ming Wang |
2012-09-18 |
| 7872347 |
Larger than die size wafer-level redistribution packaging process |
— |
2011-01-18 |
| 7834449 |
Highly reliable low cost structure for wafer-level ball grid array packaging |
Teck Yang Tan |
2010-11-16 |
| 7449365 |
Wafer-level flipchip package with IC circuit isolation |
Arya Behzad, Malcolm MacIntosh, Jacob Rael, Henry Chen |
2008-11-11 |
