Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10043924 | Low cost optical sensor package | — | 2018-08-07 |
| 8957516 | Low cost and high performance flip chip package | Mengzhi Pang, Ken Zhonghua Wu | 2015-02-17 |
| 8890298 | Embedded package security tamper mesh | Mark Buer | 2014-11-18 |
| 8749011 | System and method for reducing voltage drops in integrated circuits | Morteza Cyrus Afghahi | 2014-06-10 |
| 8643164 | Package-on-package technology for fan-out wafer-level packaging | Teck Yang Tan | 2014-02-04 |
| 8508054 | Enhanced bump pitch scaling | Mengzhi Pang | 2013-08-13 |
| 8502396 | Embedded package security tamper mesh | Mark Buer | 2013-08-06 |
| 8269321 | Low cost lead frame package and method for forming same | Ken Jian Ming Wang | 2012-09-18 |
| 7872347 | Larger than die size wafer-level redistribution packaging process | — | 2011-01-18 |
| 7834449 | Highly reliable low cost structure for wafer-level ball grid array packaging | Teck Yang Tan | 2010-11-16 |
| 7449365 | Wafer-level flipchip package with IC circuit isolation | Arya Behzad, Malcolm MacIntosh, Jacob Rael, Henry Chen | 2008-11-11 |